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To: unclewest who wrote (35597)	12/6/1999 5:29:00 PM
From: Don Green	Respond to of 93625

Tessera Licenses Chip-Scale Packaging Technology to EEMS Story Filed: Monday, December 06, 1999 8:17 AM EST SAN JOSE, Calif., Dec 6, 1999 (BUSINESS WIRE) -- Agreement Will Expand the European Infrastructure for Tessera's uBGA(R) Package Technology Tessera(R), Inc., the semiconductor industry's leading provider and licensor of chip-scale packaging technology, and EEMS Italia, SpA, one of Europe's largest integrated circuit assemblers, today announced they have signed a technology agreement that will enable EEMS to manufacture ICs using Tessera's uBGA(R) package technology. Tessera's uBGA package is one of the industry's most widely adopted chip-scale packages, having shipped over 200 million units to date. "Licensing Tessera's technology will enable us to quickly supply a broad range of IC manufacturers with the industry's leading chip-scale packaging solutions for cost sensitive applications that also require small size or high performance," said Enzo D'Antonio, president and CEO of EEMS Italia, SpA. "Tessera's unparalleled expertise and experience in chip-scale packaging gives us a competitive advantage, allowing us to focus our efforts on expanding our business to meet the growing European demand for uBGA package technology." Under the terms of the agreement, Tessera will transfer its patented Zinger 4.0 process to EEMS' manufacturing facilities in Italy, and Tessera will also provide consulting services to help bring up EEMS' uBGA production capability. EEMS expects to have its process set up and capable of volume uBGA production by the second quarter of 2000. During the set-up period, Tessera's Singapore assembly facility will serve as a virtual manufacturing site until EEMS' production line is fully operational. This value-added service, a first for Tessera, will enable EEMS to support European semiconductor companies almost immediately. "The licensing agreement with EEMS fills a critical void in our ability to locally support semiconductor makers in Europe," said Bruce McWilliams, president and CEO of Tessera. "Demand for the uBGA package has increased dramatically, driven by Flash memory in wireless and other portable applications, as well as the launch of Rambus RDRAM. By providing production and consulting services, we are enabling EEMS to fulfill that demand almost immediately." Tessera's uBGA package technology has gained broad industry acceptance and is licensed to over 30 companies worldwide. The technology sets new standards in performance, size and reliability, and is ideal for high performance, space-constrained applications such as digital cameras, cellular phones, hand-held PDAs and other communications appliances. Tessera also plans to expand the market for chip scale packaging technology into high pin count, high-performance applications such as ASIC and DSP. About Tessera, Inc. Tessera is the leading provider and licenser of Chip Scale Packaging technology to the semiconductor industry. The company's technology enables the industry to deliver semiconductor devices optimized for performance, reliability, size and cost. Tessera's uBGA(R) package technology has been adopted as the de facto standard for a number of memory architectures, with over 250 companies supporting the package with materials, equipment and test solutions. Tessera currently licenses its advanced packaging technology to over 30 assembly and semiconductor companies, including Amkor, ASE, AMD, ChipMOS, ChipPAC, EEMS, Hitachi, Hyundai, Infineon, Intel, IPAC, LG, Mitsui, Samsung, Sharp, Shinko, Sony, SPIL, ST Microelectronics, Texas Instruments and Toshiba. Tessera is based in San Jose, Calif. For more information, visit www.tessera.com. About EEMS Italia, SpA EEMS Italia S.p.A. is an independent assembly and test house for semiconductor memory. The Company provides integrated subcontract manufacturing with a focus on the memory sector, primarily Dynamic Random Access Memory (DRAM) but increasingly serving the Flash memory sector. EEMS Italia S.p.A. offers the most advanced packaging and testing techniques for new memory generation. For more information, contact +39-0746-604668. Tessera, uBGA and the Tessera logo are registered trademarks of Tessera, Inc. All other brand and product names may be trademarks of their respective companies. Copyright (C) 1999 Business Wire. All rights reserved. Distributed via COMTEX. CONTACT: The Hoffman Agency (for Tessera) Paul Barbieri (408) 286-2611 pbarbieri@hoffman.com or EEMS Italia, SpA Pasquale Amideo +39 0746 604.564 pasqualeamideo@eems.it WEB PAGE: businesswire.com GEOGRAPHY: CALIFORNIA INTERNATIONAL EUROPE INDUSTRY CODE: COMPUTERS/ELECTRONICS HARDWARE PRODUCT Today's News On The Net - Business Wire's full file on the Internet with Hyperlinks to your home page. Copyright © 1999, Business Wire, all rights reserved.

To: unclewest who wrote (35597)	12/6/1999 5:30:00 PM
From: Don Green	Read Replies (1) \| Respond to of 93625

Interactive Silicon Inc. Successfully Completes Second-Round Funding; Several Corporations Take a Stake in the Austin Start-Up ------------------------------ Story Filed: Monday, December 06, 1999 10:14 AM EST AUSTIN, Texas, Dec 6, 1999 (BUSINESS WIRE) -- Interactive Silicon Inc. ("ISI") announced today that it has successfully closed its second round of funding. The round included several corporate investors, including Dell Computer Corporation, Siemens Venture Capital and Synopsys Inc., as well as venture funding from Austin Ventures and TVM Techno Venture Management. Also participating in the second round funding were several individuals from the Band of Angels(tm), as well as the Band's own investment fund. This investment marks the first time this Silicon Valley organization has invested outside of California. "ISI epitomizes the innovative new technology being developed in Austin," noted Hans Severiens, a Manager Member of the Band of Angels Fund, L.P. "ISI's innovations represent a new way of bringing more performance to servers and workstations." ISI's technology is aimed at improving the performance of a computer's memory subsystem by managing the data more efficiently. "There are rather dramatic forces going on in the memory marketplace today such as the large swings in pricing and the race to increase bandwidth with DDR and Rambus," noted Interactive Silicon's CEO, Jim Garrett, formerly President of Micron Technology. "These forces demand that computer system OEMs get every bit of performance from their memory subsystem. Our technology will do just that in a novel way." About Interactive Silicon Inc. Founded in Austin in 1998, ISI is a fabless semiconductor and software company. Initially, it plans to build integrated circuits, which will be combined with sophisticated driver software and aimed at the server and workstation markets. The final product will run in conjunction with Windows NT and Linux, using patented, parallel memory management technology to increase the system performance dramatically. The technology is presently running in prototype silicon. More information on ISI can be found on the World Wide Web at: interactivesi.com. Copyright (C) 1999 Business Wire. All rights reserved.

To: unclewest who wrote (35597)	12/6/1999 5:31:00 PM
From: Don Green	Respond to of 93625

INTERSIL'S FAMILY OF MULTIPLE-OUTPUT POWER CONTROLLERS DELIVER A COMPLETE MOTHERBOARD POWER SOLUTION THREE NEW POWER MANAGEMENT ICS Targeted at the ACPI Power Management Initiative; Replaces as Many as Thirty-Five Discrete Components -------------------------------------------------------------------------------- Story Filed: Monday, December 06, 1999 2:00 PM EST PALM BAY, Fla., Dec 6, 1999 /PRNewswire via COMTEX/ -- Intersil Corporation announced today the HIP6500, HIP6501A, and HIP6502 multiple-output regulators targeted at computer motherboards supporting the Advanced Configuration and Power Interface (ACPI) power management specification. Intersil's ACPI circuits provide board designers with simple, cost-effective ways to implement a full motherboard power solution, without sacrificing ease-of-use, flexibility or adaptability. The HIP6501A is a triple linear controller, whereas the HIP6500 and HIP6502 regulate and control five voltage planes. The HIP6501A replaces as many as 29 external components used in a discrete ACPI power management implementation. The HIP6500 and HIP6502 replace up to 35 discrete components by integrating two additional regulators. While reducing Printed Circuit Board (PCB) area and Surface-Mount component placement costs, the HIP6500, HIP6501A, and HIP6502 improve system reliability. They interface with the computer system through four digital lines, enabling four support configurations and ACPI interface control that allows the computer operating system to control the system hardware and delegate power delivery according to the requirements of each individual sub-system block. In addition, the HIP6500, HIP6501A, and HIP6502 offer a host of system monitoring and protection features such as soft start, over current, under voltage protection, over temperature, and prevention of "illegal" ACPI state transitions. The implementation of the HIP6500, HIP6501A, and HIP6502 in the ACPI power system is simple and beneficial to the system designer. After following the recommended application circuit, only the selection of output capacitors and transistors varies. The regulator then operates seamlessly with the ACPI software, regulating sleep-state voltages. "Our development team asked themselves the question: If we were motherboard designers, how would we implement ACPI power management in the simplest, most economical and robust fashion?" said George Lakkas, product marketing manager at Intersil. "The answer was our ACPI power controller IC family. These devices are sophisticated, yet easy-to-use. The product family enables hardware designers to focus on other critical system design tasks, resulting in a dramatic reduction of product Time-To-Market (TTM)." The HIP6500, HIP6501A, and HIP6502 utilize an ATX supply ("silver box") and work in conjunction with the HIP6020/21 four-in-one PWM (Pulse-Width- Modulated) controllers and Intersil's 30V n-channel UltraFETs to simplify and optimize the power supply design on ACPI-compliant motherboards. Technical Information About the HIP650X Whenever possible, compatibility with driving external bipolar transistors was designed into the integrated circuit, reducing system cost relative to motherboard regulators utilizing only MOSFETs. Up-integration and intelligent design result in the HIP6500, HIP6501A and HIP6502 requiring only eight external components to regulate the ACPI active or sleep-state voltages needed on today's motherboards. The HIP6500, HIP6501A, and HIP6502 also employ a built-in 200 nanosecond delay when processing either an S3 or S5 request. The integrated delay enables proper active-to-sleep state (S0-to-S5) transitions. The HIP6501A regulates the 5V dual voltage plane needed for the universal serial bus, keyboard and mouse; the 3.3V dual voltage plane needed for the peripheral component interface slots; and the 2.5V/3.3V memory plane needed for Rambus Dynamic Random Access Memory (RDRAM) and Synchronous Dynamic Random Access Memory (SDRAM). The HIP6500 regulates two additional voltages: the 3.3V stand-by and 2.5 clock voltage. The HIP6502 differs from the HIP6500 in that it combines the 3.3V dual voltage plane and 3.3V stand-by voltage planes in one output pin, and provides two individual 2.5V memory plane and 3.3V memory plane outputs for motherboards that utilize both RDRAM and SDRAM memories. Pricing and Availability The HIP6501A comes in a small 16-pin narrow-body SOIC package. The HIP6500 and HIP6502 are offered in 20-pin narrow-body SOIC packages. Pricing for the entire family is as follows: Part Number Package 10K Piece Price HIP6500CB 20L SOIC $2.07 HIP6501ACB 16L SOIC $1.71 HIP6502CB 20L SOIC $2.11 About Intersil Corporation Intersil Corporation uses analog, mixed-signal, wireless communications and power technologies to develop advanced integrated circuits and power semiconductors for high-growth segments of the communications, power and space/defense markets. Intersil Corporation employs 5,800 worldwide and utilizes the rich intellectual property of more than 1,400 patents. The company's web site is located at intersil.com.

To: unclewest who wrote (35597)	12/6/1999 5:33:00 PM
From: Don Green	Respond to of 93625

TEKTRONIX: Tektronix 2000 measurement products catalogue features products for every signal type -------------------------------------------------------------------------------- Story Filed: Monday, December 06, 1999 3:53 PM EST DEC 6, 1999, M2 Communications - Tektronix, Inc. has announced the availability of its new 2000 Measurement Products Catalog. Available in paper and CD-ROM, the catalogue features a broad offering of test equipment. With a comprehensive family of more than 1,400 test and measurement products, Tektronix is providing solutions for "Next Generation" global communications networks and Internet technologies. Solutions range from low-cost instrumentation and handheld products to conventional measurement products and advanced mixed-signal test solutions. The 600-page, soft cover catalogue includes a full colour, new product section that highlights new products and measurement solutions for Rambus systems, RF design, and mobile and core telecommunications networks. Extensive indexes list products by name and by function, as well as by categories such as oscilloscopes, logic analysers, telecommunications and television test. Also included is a list of all Tektronix worldwide sales offices, distributors and representatives. In addition to the paper catalogue, measurement product information is also available on CD-ROM and on the Tektronix Worldwide Web site at ww.tektronix.com/home/products.html. The CD-ROM offers quick and easy access to information including data sheets and contact information, and provides more than 20 selection guides and tutorials. Navigation is even easier this year, with no mandatory plug-ins needed to view the catalogue. Users who access the Web site via the CD-ROM will find all of the information contained in the catalogue plus up to the minute updates on all Tektronix products. News, product demonstrations and editorial material can also be found on the Web site. To receive a 2000 Measurement Products paper catalogue or CD-ROM catalogue please contact Imelda Khoo. Please specify which type of catalogue you would like to receive. Notes to editors: Today Tektronix, Inc. is comprised of measurement and colour printing businesses. The company is headquartered in Wilsonville, Oregon and has operations in 26 countries outside the United States. Founded in 1946, Tektronix had revenues of $1.9 billion in fiscal 1999. The company recently announced it has reached agreement to sell its colour printing business to Xerox Corporation. After the transaction closes, Tektronix, Inc. will be a focused measurement company. Copyright 1994-99 M2 COMMUNICATIONS LTD CONTACT: Imelda Khoo, Tektronix UK Ltd Tel: +44 (0)1344 392000 Rebecca Smith/Richard Peters, The WhiteOaks Consultancy Ltd. Tel: +44 (0)1252 727313 e-mail: rebeccas@whiteoaks.co.uk M2 COMMUNICATIONS DISCLAIMS ALL LIABILITY FOR INFORMATION PROVIDED WITHIN M2 PRESSWIRE. DATA SUPPLIED BY NAMED PARTY/PARTIES. Copyright © 1999, M2 Communications Ltd., all rights reserved

To: unclewest who wrote (35597)	12/6/1999 5:59:00 PM
From: Tenchusatsu	Read Replies (1) \| Respond to of 93625

Unclewest, <timna with mth and sdram is so slow compared to timna with rdram it may never make it. intel certainly cannot use mth to compete with sony.> Cost is the main issue with Timna-based PCs, not necessarily performance. Pairing up Timna with an MRH-S component (formerly known as MTH) might be a drag on performance, but if RDRAM prices stay high through Timna's release, Intel might have no other choice but to support SDRAM on Timna as an interim solution. By the way, unless Timna is going into Microsoft's rumored game box, I fail to see how Timna-based systems are going to compete with Sony Playstation 2 in anything except an indirect sense. How many people are willing to buy a PS2 just for e-mail, web browsing, and downloading MP3 files? (You have to buy a PS2 keyboard, then a PS2 storage device, then get a PS2-specific Internet connection, etc.) Tenchusatsu

To: unclewest who wrote (35597)	12/6/1999 7:42:00 PM
From: Dave B	Respond to of 93625

uncle, the third slot problem is identified and resolved. i hear the next mobo iteration will have 3 slots. anyone hear about a copper problem? Funny you should bring this up. I saw my first Rambus motherboard today at Fry's Electronics (an electronics superstore in the SF, LA, and Seattle [I think] areas). It was an AOpen board (the AX6C) with 3 RIMM slots and according to the manual could support everything up to RDRAM-800 and beyond (up to RDRAM-1066). It was $199 versus the CC820 at $159. They had them in stock and right after I finished looking at it, someone else picked up the manual and started reading it. I took that as a positive sign. Dave