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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Duker who wrote (33441)	12/7/1999 9:29:00 AM
From: Proud_Infidel	Read Replies (1) \| Respond to of 70976

Tuesday December 7, 7:31 am Eastern Time Company Press Release Philips Orders Applied Materials' Electra Copper Systems for Development of Advanced Chips Integrated Endura(R) Electra Barrier & Seed and Electra Cu(TM) ECP Systems Will Be Used for Philips' Advanced Copper Interconnects SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec. 7, 1999-- Philips, Europe's largest manufacturer of semiconductor devices, has ordered Applied Materials' integrated copper metallization technologies, the Endura® Electra(TM) Barrier & Seed and Electra Cu(TM) ECP (ElectroChemical Plating) systems, to enable the development of faster, more powerful chips. The systems have been installed at Philips Research in Eindhoven, the Netherlands. Mart Graef, department head for Semiconductor Process Modules of Philips Research, said, ''Applied Materials' extensive experience in copper technology and expertise in process integration provides us with a technically matched, optimized set of systems that we can quickly integrate into our copper designs. Preliminary testing on both of these Electra(TM) systems has shown excellent performance results and should enable us to save time in advancing our chip designs into volume production.'' Applied Materials has been implementing its copper technologies in stages over the past two years starting with the Endura Electra Barrier & Seed system which was launched in December 1997. Created to deposit the tantalum-based barrier layer and copper seed layer as an integrated process sequence under vacuum, the Endura Electra Barrier & Seed system quickly became the market share leader in this technology and today is used by 19 top chipmakers engaged in copper development and production. In April 1999, Applied Materials introduced its Electra Cu ECP system which features major advances in chemical management, process chemistry and system productivity for copper production manufacturing. ''Philips' technology development capability is world class and working with them to implement our Electra systems into their copper process flow should allow us to rapidly gain a fuller understanding of its potential,'' noted Robin Cheung, general manager of Applied Materials' Copper Division. ''This is an outstanding opportunity for us to rapidly move these integrated systems forward toward copper production.'' Applied Materials, Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the global semiconductor industry. Applied Materials is traded on the Nasdaq National Market System under the symbol ''AMAT.'' Applied Materials' web site is www.appliedmaterials.com.