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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?


To: Mani1 who wrote (82284)12/7/1999 10:18:00 PM
From: Bill Jackson  Read Replies (2) | Respond to of 1576945
 
Mani, I would think a calorimetric method would take a few minutes for the heated parts to reach a steady state. I am not sure how extensively the parts are tested and at what stages. I expect they will have a tester that tests them very early on when they are at the die stage, and only those that get past that will go on to get cut and tested further and this will continue until the part is fairly well known characterised it gets packaged and then it is tested further. The package is quite costly and there is no point in packaging fine looking gold scrap. Process Boy or some others will be able to fully describe these test procedures as they see them all the time. Where is PB, no comments for two weeks now? Over worked?

Bill



To: Mani1 who wrote (82284)12/7/1999 10:20:00 PM
From: Elmer  Respond to of 1576945
 
Re: "Yes, exactly. Thermal design is the reason AMD quoted those power numbers in their spec sheet. I by no mean, meant to suggest that it is used for "binning" data. I have no idea how that is done."

Obviously.

EP