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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: tejek who wrote (82633)	12/10/1999 6:54:00 PM
From: Bill Jackson	Respond to of 1572099

Ted, From what i read the damascene process deposits a layer of copper over an area and the excess copper is then ground away with a very fine gritleaving the copper only in the low lying spots. I can see this as being a very sensitive process to over grinding, large grits, large copper bits peeling off and rolling up and getting scraped over very this mask/oxide/etc layers. The work piece and the tool would have to be very stiff and flat as possible and the grit would need to be uniform and very fine. I asked bery earlier and he said that the fine copper scraps that get dragged somewhere and left there and then get plated into the circuit and shorting stuff together, and even cutting fine traces as they are dragged across by the tool. From the look of it there is a slow evolution of a proper 'ritual' in doing copper damascene to try and minimize the copper that is carried to the wrong place. It also looke that it will have a yield hit as it will never get as high in yield as them older processes? Anyone have direct experience and can say?? Bill