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To: Zeev Hed who wrote (906)12/14/1999 12:06:00 AM
From: golfnvester  Respond to of 1099
 
Zee - you are certainly more knowledgeable than i about the technology. i've never intended to suggest that i have any expertise in the field. a couple of questions for ya

1. do you own ISON stock. if yes, why & what are your current expectations from the company, if no, why not.

1b. what is your interest in the board.

2. what is your industry expertise on this matter, without giving the name of your employer "who do you work for"

3. what technology would you expect to see solve the heat problem in future generations of microprocessors.

_____

yes i own ISON, couple thousand, i found ISON from research on my SILEX stock...i am aware of their efforts in Uranium enrichment. i'm a BSME, with 10 yrs chemical industry experience, mostly sales/mktg. i do what i can with my own investments, diversify with lots of long shots. i've done limited reading on microchips and the concept of increased heat generation as speeds increase. this is the only small company that i know of to invest in at this point.



To: Zeev Hed who wrote (906)12/14/1999 7:25:00 PM
From: Merlin  Read Replies (2) | Respond to of 1099
 
I believe that you miss the point in your comparison of Si and GaAs. The ability of silicon to be passivated by a native oxide with excellent dielectric properties is the most significant factor in preventing GaAs from displacing silicon. Although GaAs has a greater carrier mobility, it is much easier to fabricate fine geometries on Si, and Si has better handling properties. It isn't so much the raw material cost as it is the overall processing cost. As far as material cost goes, an AMD Athlon die has an area of 102 square millimeters. Assuming a die thickness on the order of .01", the silicon mass is about 60 milligrams. At $75,000/kg the raw material cost for the Athlon die would be about $4.50. Considering that a high speed Athlon sells for more than $500, I would say that the increased cost of material would be insignificant if the yield on the Athlon is reasonably good. Also, I would think that the silicon in bad devices could be recycled. The question is: How much improvement in overall thermal resistance can be achieved for a packaged device by the use of Si-28 in the die?