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To: Philip W. Dunton, Jr who wrote (2297)	12/16/1999 10:30:00 AM
From: James Calladine	Read Replies (1) \| Respond to of 3661

Philip: I feel as you do--starving for news or any sense of how the company is doing presently such as: -- product releases -- analyst coverage -- ANY news of sales (some companies do it without relating to whom, if that is a big issue) -- awards -- anything! I can't help but feel that NOBODY in MTSN is focused on creating the MARKET PERCEPTION of MTSN. That is pretty diabolical when we live in a market which is largely based on hype and market perception generally. Best wishes, Jim

To: Philip W. Dunton, Jr who wrote (2297)	12/16/1999 12:18:00 PM
From: Ian@SI	Read Replies (1) \| Respond to of 3661

Phil, Quit your whining, eh! ;-) News is where you want to find it. e.g. Guess who's going to give, or has already given, MTSN another sizeable CVD order along with a Strip order... Clue: Samsung starts work on new DRAM fab, plans production in 2000 Semiconductor Business News (12/16/99, 08:55:57 AM EDT) SEOUL--Samsung Electronics Co. Ltd. today said it has begun construction of a new 8-inch wafer processing plant, called Line 10, which will start production of DRAMs in the second half of 2000. Located in the city of Hwasung-gun, the new $1.8 billion fab is scheduled to ramp up to 32,000 eight-inch wafer starts per month by early 2001, Samsung said. Initially, Line 10 will be dedicated to production of 128- and 256-megabit DRAMs, including memories with the Rambus Inc. interface. The Korean chip maker plans to equip the 8-inch fab with tools for 0.15-micron process technologies. Samsung said investments in Line 10 will help it maintain its lead in memory production. Earlier this month, company officials disputed some industry estimates that showed rival Hyundai Electronics Industries Co. Ltd. had taken the No. 1 position in DRAM market share (see Dec. 7 story). The first construction phase of Line 10 will be completed by the third quarter next year, when monthly wafer starts will total 16,000, according to Samsung. ... ++++++++++++++++++++++ And take a guess where another large order has come from. CLUE: TSMC Breaks Ground for First Twelve-Inch Fab in Hsin-Chu HSIN-CHU, Taiwan--(BUSINESS WIRE)--Dec. 15, 1999--Taiwan Semiconductor Manufacturing Company Ltd. (NYSE: TSM - news) held a groundbreaking ceremony in the Hsinchu Science-Based Industrial Park (HSIP) this morning, heralding construction of the company's first 12-inch (300-mm) wafer fab. The new fab, known as Fab 12, is now officially under construction, with first wafer production scheduled to begin in early 2002. The groundbreaking ceremony was hosted by F.C. Tseng, president of TSMC. 'TSMC is dedicated to the pursuit of new technology development and capacity expansion, thereby sustaining our leadership position, increasing barriers to competition, and providing the best dedicated foundry services for our customers worldwide,' said FC Tseng. 'At an investment of more than $2 billion U.S. dollars, Fab12 will serve both as a fabrication base and a leading-edge research and development center. 'In addition,' FC Tseng continued, 'we have scheduled a groundbreaking for Fab 7 in the Tainan Science-Based Park in early 2000. Also, our capacity next year is expected to increase by approximately 50 percent.' Construction of Fab 12 is expected to be complete within two years. The superstructure is expected to be finished by the end of year 2000, followed by the installation of the cleanroom. Equipment move-in will begin in the year 2001, with mass production commencing in early 2002. Fab 12 will pilot run with 0.15/0.13um process technology, and then evolve to 0.1um. Fab 12 is expected to produce a variety of logic, memory, and chip set products, and the total capacity will reach 25,000 12-inch wafers per month. Some additional Fab 12 capacity will be reserved for research and development of the new 0.1um and more advanced process technology.