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Technology Stocks : Kulicke and Soffa -- Ignore unavailable to you. Want to Upgrade?

To: cluka who wrote (3589)	12/21/1999 8:01:00 AM
From: Darin	Read Replies (1) \| Respond to of 5482

MORE GOOD NEWS! Tuesday December 21, 7:01 am Eastern Time Company Press Release Kulicke & Soffa Announces Flip Chip Technologies License Agreement WILLOW GROVE, Pa.--(BUSINESS WIRE)--Dec. 21, 1999--Kulicke & Soffa Industries, Inc. (NASDAQ:KLIC - news) today announced that Flip Chip Technologies (FCT), L.L.C. signed a 10-year technology transfer agreement with Siliconware Precision Industries Co., Ltd. (SPIL), one of the semiconductor industry's largest IC assembly, packaging & test manufacturing service companies. SPIL will use FCT's proprietary Flex-on-Cap (FOC) wafer bumping and redistribution technologies to manufacture advanced flip chip packages at its Taichung, Taiwan assembly facility, beginning in the fourth quarter of calendar year 2000. As part of the agreement, SPIL engineers will be trained in Phoenix, and FCT engineers will provide on-site support at the Taichung factory during start-up. According to SPIL Vice President of Research & Development Randy Lo, the FCT process was selected for a combination of reasons, following a lengthy evaluation. ''FOC is the most robust and reliable wafer bumping process, and has been proven for many years in demanding applications involving billions of device interconnects,'' he said. ''It is the most cost-effective flip chip process and delivers extremely high yields.'' ''We are very pleased to announce this new license,'' said Don May, K&S Vice President for Technology Licensing. ''The SPIL license is a strategic stepping stone in our growth, and we appreciate SPIL's demonstration of confidence in FCT's technology. This license, given SPIL's significant industry position, again recognizes FCT as the world's leading provider of wafer bumping services.'' Earlier this year, FCT announced a licensing agreement with Advanced Semiconductor Engineering, Inc. (ASE) of Kaohsiung, Taiwan. Based in Phoenix, AZ, FCT is an innovative, high-volume wafer bumping resource providing IC packaging services and expertise to the semiconductor industry. A joint venture of Kulicke & Soffa Industries and Delphi Delco Electronics Systems, FCT offers proven merchant wafer bumping services, and technology licensing used in applications requiring higher performance, reduced form factor, and lower costs than those obtainable through other techniques. For more information on FCT visit www.flipchip.com. Kulicke & Soffa is the world's largest supplier of semiconductor assembly equipment. The company provides scalable solutions for the assembly of chip and wire, flip chip and chip scale packages. Chip and wire solutions combine wire bonding, die bonding and wafer dicing equipment with wire, capillaries, die collets, saw blades and die attach materials. Flip chip solutions include die placement equipment, flip chip bumping technology, glob top and underfill materials, and thin film laminates. K&S also offers unique CSP packaging technology as well as factory integration products and services. It has sales, service and applications development facilities worldwide. Kulicke & Soffa's web site address is www.kns.com. Contact: Kulicke & Soffa, Willow Grove Media: Henri Van Parys, 215/784-6818 or Analysts: Nancy R. Kyle, 215/784-6436