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To: Darryl Olson who wrote (23837)	12/22/1999 1:05:00 PM
From: Proud_Infidel	Respond to of 25960

Sematech gears up to test 157-nm lithography at 0.09 micron and below Semiconductor Business News (12/22/99, 09:06:04 AM EDT) AUSTIN, Tex. -- As part of its work to extend the use of optical lithography in the next decade, International Sematech here said it has begun installation of a 157-nanometer exposure tool in the consortium's resist test center. The F2 laser Microstepper from Exitech Ltd. of Oxford, England, will be used to test 157-nm exposures for 90-nm and below device feature sizes using subwavelength techniques. Sematech said it expects to begin using the tool in the first quarter of 2000. "This is a critical tool in assessing the possibilities of extending photolithography to resolutions below 90-nm," said Gerhard Gross, lithography director at the Austin-based research consortium. "We are fortunate to be among only a few places in the world to have this exposure capability." The Exitech system has an image field size of a 1.5-x-1.5 mm image field size. The tool will primarily be used by Sematech to conduct high-resolution exposures at 157 nm for photoresist development programs. Sematech said it will make the exposure tool will be available to its member companies and resist manufacturers. The Exitech Microstepper uses a 6-watt, 157-nm Novaline F630 F2 laser from Lambda Physik Inc. of Fort Lauderdale, Fla., and a 0.6NA 157-nm imaging objective from Tropel Corp. of Fairport, N.Y.