To: manny t who wrote (54543 ) 12/30/1999 11:05:00 PM From: puborectalis Respond to of 108040
More on KOPN...recent deal with Mitsubishi.....Mitsubishi Electric's order complements Kopin's strong presence in the digital wireless handset marketplace. Kopin already supplies its GaAs HBT transistor components for digital handsets incorporating the CDMA standard. In addition, Kopin is providing HBT products for OC-48/OC-192 SONET/ATM systems, which form the backbone of the highest speed fiber optic networks. Kopin recently announced that it is quadrupling its HBT capacity for completion by the end of the first quarter of 2000. ''Demand for our GaAs HBT transistors continues to grow rapidly as evidenced by this latest major program win,'' Dr. Fan said. ''The addition of Mitsubishi further expands our customer base and our product offerings. Given the existing strength in our HBT business, our facility will reach full capacity in 2000. Consequently, we are now actively evaluating additional manufacturing locations that will allow us to properly address our future capacity needs.'' ''The ability to provide a portfolio of high quality 6-inch HBT transistor wafer products in high volume is a significant milestone for Kopin and the industry,'' stated Dr. John C.C. Fan, Kopin's President and Chief Executive Officer. ''This accomplishment enables our HBT circuit partners to support the explosive market demand for advanced telecom circuits by aggressively moving to 6-inch production in 2000. The 6-inch wafers provide significant benefits to our partners in cost, yield, volume, capacity and the wider availability of 6-inch circuit processing equipment.'' ''Kopin can now produce five 6-inch HBT transistor wafers per run instead of producing these transistors one wafer at a time,'' Fan continued. ''Transistor performance results on 6-inch wafers from our new platform are comparable to the high performance transistors we provide from our high volume, multiple 4-inch wafer platform.'' ''Kopin continues to bring on-line new HBT products such as our 6-inch InGaP and AlGaAs transistor wafers and new production capacity at an unprecedented rate,'' said Daily S. Hill, Kopin's Vice President of GaAs Operations. ''Our capacity expansion is proceeding smoothly and on schedule. Throughout the second half of 1999, we have demonstrated that we can bring on-line high volume 4-inch systems in an efficient, modular fashion. Meanwhile we have transferred our proprietary HBT processes to a larger platform capable of providing multiple 6-inch transistor wafers per run with consistently excellent physical and transistor characteristics. The larger platform gives Kopin the flexibility to quickly respond to either 4-inch or 6-inch market demand.'' ''We are presently installing production capacity at a rate of a new system per month,'' Hill continued. ''New installations will continue into 2000 as Kopin expands its infrastructure build out for the exploding wireless and fiberline