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To: Duker who wrote (3803)	1/6/2000 5:37:00 PM
From: Proud_Infidel	Respond to of 5867

Intel decides on Chandler, not Fort Worth, as site for 300-mm fab By Jack Robertson Semiconductor Business News (01/06/00, 03:59:09 PM EDT) SANTA CLARA, Calif. -- Intel Corp. here has apparently rejected Fort Worth, Tex., in favor of Chandler, Ariz., as the location of its first 300-mm wafer production fab. An Intel spokesman today confirmed that “the pre-qualification study has been completed for building a new 300-mm fab in Chandler." No final decision has been made yet, he added. At the same time, the Fort Worth site has been bypassed for the time being and "will remain on hold," the spokesman said. Intel twice in the past two years has put the brakes Intel already has a fab complex in Chandler, and last year elected to put its major packaging R&D center at the Arizona site. With a sizable infrastructure already in place, Intel felt it could move quickly in Chandler to launch its first production 300-mm fab, which is on an accelerated schedule, sources said. The Intel spokesman also said questions on tax incentives in Texas that arose after its initial selection of Fort Worth are continuing to put that site on hold. Intel discovered that under Texas state law, the Fort Worth school district would lose state funding equivalent to any tax incentives provided to Intel. The chip company said it is still negotiating with various governmental officials in Texas to work out the tax issue. In the meantime, Intel has all but decided on Chandler for the 300-mm fab. Intel last year launched its 300-mm program by starting a pilot line at its Hillsboro, Ore. development fab complex. That will soon be joined by a companion 300-mm development fab that will ramp up to low initial production. The full-scale Chandler production fab would begin output in 2002, sources said. Intel will launch 300-mm production with 0.13-micron processing, after the next-generation design rules have been initially tested in 200-mm production. Intel has placed a $100 million order for 193-nanometer wavelength scanners with SVG Lithography, of Wilton, Conn., for the 0.13-micron production lines.

To: Duker who wrote (3803)	1/10/2000 10:26:00 AM
From: Proud_Infidel	Read Replies (2) \| Respond to of 5867

Semiconductor-making equipment demand seen up NEW YORK, Jan 10 (Reuters) - Demand for equipment used in the first stages of manufacturing by semiconductor equipment makers is expected to grow by more than 43 percent this year, according to a study released on Monday by the market research company Dataquest. Revenue for wafer fabrication equipment makers is expected to grow 43.5 percent, to $25.1 billion from $17.5 billion in 1999, when the growth rate was 19.4 percent, said Dataquest, a unit of Gartner Group Inc. (NYSE:IT - news). Dataquest said that growth rate is conservative and could potentially range between 50 percent and 60 percent. ''Right now we do not see the number of projects being able to support a higher than 43 percent growth rate,'' said Clark Fuhs, director for Dataquest's semiconductor manufacturing programs. If projects for new facilities were announced in the next few months, or if projects scheduled for 2001 were moved up to 2000, then the growth rate likely could be 50 percent to 60 percent, Fuhs said. While the growth of revenues for equipment makers is expected to ease from 2000's pace, double-digit growth is expected to continue through 2002. In 2001 a growth rate of 35.8 percent is forecast and a rate of 12.5 percent is seen for the following year. The growth has been driven by better-than-expected personal computer and cellular phone shipments, as well as the continued investment in infrastructure associated with Internet applications, Dataquest said. Wafer fab equipment, or front-end equipment, represents about 80 percent of the semiconductor equipment market, with back-end equipment, such as equipment used to package chips, omprising the remainder. biz.yahoo.com