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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Cirruslvr who wrote (85864)	1/7/2000 4:43:00 PM
From: Greater Fool	Respond to of 1572773

>>What's the difference between the Celeron's packaging and the K6-2's? Celeron's packaging includes the die package and the module (the outer plastic box wrapped around a printed circuit board). AMD's package is just the package around the die, but is more expensive than the Celeron inner package, as the former has leads where the latter has solder balls.

To: Cirruslvr who wrote (85864)	1/7/2000 5:09:00 PM
From: Saturn V	Read Replies (1) \| Respond to of 1572773

Ref< What's the difference between the Celeron's packaging and the K6-2's? > The Celeron package is a plastic package for wire bonded die. The K-6 is exclusively designed for flip chip bonding which has required an expensive ceramic package. The Intel designs had the option of either wire bond or flip chip packaging. So the high speed parts and some laptop products have used flip chips. The cheaper low speed parts have been wire bonded and used plastic packaging. During the course of last year Intel introduced the OLGA package, which is a low cost flip chip package which I believe costs $12 or less. I believe Intel is the only one using the OLGA package, but in due time I expect AMD to adopt it too.