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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Bill Jackson who wrote (85949)1/7/2000 10:52:00 PM
From: Elmer  Read Replies (1) | Respond to of 1572859
 
Re: "Kenith if the inner part of the die is flip chipped then the part of the die that projects beyond this can be wirebond? Just a speculation? That way they can use some perimeter contacts of the older style and also connect in the middle of the die, here and there. If someone knows the true answer to this, please comment."

Bill write down this date, hop on a plane to Vegas and bet the wad. You actually got something right but no doubt it was pure luck.

EP



To: Bill Jackson who wrote (85949)1/8/2000 5:38:00 PM
From: Kenith Lee  Read Replies (1) | Respond to of 1572859
 
Bill,

I don't know. IBM does have a huge portfolio of hybrid and multi-chip packagings. You may want to read on some of their patents.


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