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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Tony Viola who wrote (33671)	1/10/2000 2:25:00 AM
From: Jeffrey D	Read Replies (2) \| Respond to of 70976

Applied Materials Launches Industry's First In-Line Metrology SEM System with 3D Imaging SANTA CLARA, Calif.--(BUSINESS WIRE)--Jan. 10, 2000-- VeraSEM(TM) 3D Metrology SEM(TM) Allows Chipmakers to Image and Measure Feature Profiles to Achieve Tighter Process Control and Higher Yields Applied Materials Inc. today announced the VeraSEM 3D Metrology SEM (scanning electron microscope), the first in-line production-worthy CD (critical dimension) - SEM system to provide three dimensional imaging technology. In addition to measure CDs, the VeraSEM 3D images the sidewall profile of device features down to 100 nanometers (0.1 micron) with up to 10x greater resolution of the slope than existing SEMs. Achieving in seconds what takes hours to do by costly off-line analysis, VeraSEM enables chipmakers to realize higher yields and reduce costs through the early detection of process excursions. "As chip geometries shrink, traditional line dimension and contact hole diameter measurements do not provide sufficient information for the tight and accurate monitoring of process quality," said Gino Addiego, president of Applied Materials' Process Diagnostics and Control group. "Concurrently with CD measurement, the VeraSEM 3D provides chipmakers with a view of the slope and shape of the most aggressive features with stereoscopic side wall imaging, including high aspect ratio contact holes and trenches. By quickly detecting variations in these critical structures in-line, the VeraSEM allows customers to rapidly identify process problems that would be undetectable on existing top-down CD-SEMs, and thereby achieve higher product yields at lower production costs." Unlike other profile viewing techniques that require off-line destructive testing, such as cross-section SEMs, the VeraSEM 3D allows chipmakers to rapidly monitor wafers between process steps and automatically alert operators to marginal or out-of-spec conditions. The system's in-line operation also saves costs by potentially eliminating the need for numerous, expensive test wafers. The VeraSEM 3D is also expected to be key to emerging copper applications where maintaining slope shape is critical for preventing voids in dual damascene structures. Extending the production-worthy qualities of Applied Materials' first VeraSEM systems introduced in February 1999, the VeraSEM 3D also features fully automated, 'operator free' operation, high throughout, shared database, offline programming and online data analysis. The system's design accepts both 200mm and 300mm wafers with minimal changes. Several VeraSEM 3D systems have already been ordered by chip and lithography tool manufacturers in the U.S. and Europe. VeraSEM 3D systems are also being used in advanced etch process development at Applied Materials' technology facilities in Santa Clara, Calif. Dataquest, a market research firm, estimated the market for CD-SEM systems at $222 million in 1998 and projects it to grow to $529 million by 2003. Applied Materials Inc. is a Fortune 500 global growth company and the world's largest supplier of wafer fabrication systems and services to the worldwide semiconductor industry. Applied Materials is traded on the Nasdaq National Market System under the symbol "AMAT." Applied Materials' web site is www.appliedmaterials.com. CONTACT: Applied Materials Betty Newboe, 408/563-0647 (editorial/media) or Carolyn Schwartz, 408/748-5227 (financial community) KEYWORD: CALIFORNIA BW0025 JAN 09,2000 22:17 PACIFIC 1:17 EASTERN