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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Kenith Lee who wrote (86078)	1/8/2000 11:05:00 PM
From: Bill Jackson	Respond to of 1572938

Kenith, I am not in the industry and there are probably others who have done this. I cannot be the first on this, it seems a simple extension of the IBM bumptech, and thus would just be an improvement on it. So in essence what I say is: Interlayer connection of several.....IBM has done it Interlayers cooling fluid???......may be new? Use of both insulating and conducting bumps to maintain bending stresses in the dies to acceptable levels...may be new? If it has value, perhaps someone will run with it with me. Bill