To: Duker who wrote (3829 ) 1/11/2000 9:42:00 AM From: Proud_Infidel Respond to of 5867
Chip foundries could take over the 300-mm movement too By J. Robert Lineback Semiconductor Business News (01/11/00, 09:00:14 AM EDT) PEBBLE BEACH, Calif. -- Make way for the pure-play silicon foundries, which are not only driving the long-awaited recovery in semiconductor capital investments but now it appears they will become real heavyweights in the early round of 300-mm wafer fabs. Dedicated foundry companies could account for up to half of the 40 or more 300-mm fabs that are expected to be in place by the middle of this decade, according to Michael M. Pawlik, vice president of corporate marketing at Taiwan Semiconductor Manufacturing Co. Speaking at the industry's first executive summit of 2000 here this week, Pawlik predicted that at least 20 of these "megafabs"--costing as much as $4 billion each--could be operated by dedicated foundries in the 2005-06 timeframe. "The question is what companies can afford this level of investment and be able to quickly load these fabs with products?" asked the executive from TSMC, which is the world's largest foundry supplier. Dedicated foundry companies, serving multiple chip houses and other customers, are expected the most likely candidate to make these huge investments, according to Pawlik and industry analysts during the annual Industry Strategy Symposium. Dataquest analyst Clark Fuhs not only agrees, but he believes silicon foundries could end up with more than half of the 300-mm wafer fabs by 2008. "The 300-mm generation will not be driven by the same forces of previous wafer diameters," maintained Fuh in an interview prior to his presentation today at the ISS meeting. "This time the larger-diameter wafers are not required because of larger die sizes but because of the sheer volume of silicon or 'cash flow' of capacity in fabs," said the Dataquest analyst, who is based in San Jose. "It's coming down to the size of the facility." With Taiwan's largest foundry companies now gearing up to process 60,000 to 80,000 eight-inch wafers a month in their next new chip plants, Fuhs believes 200-mm diameter substrates will becoming less practical and finally give way to 300-mm (or 12-inch) wafers. For nearly three years, fab equipment manufacturers have been waiting for 300-mm tool orders after investing billions of dollars to develop them, but high startup costs, the chip recession, and the ability to shrink devices have held back the migration to the larger wafer size. But the holdup is changing, said semiconductor analyst Bill McClean of IC Insights Inc., who presented his chip forecast before the annual meeting sponsored by the Semiconductor Equipment and Materials International (SEMI) trade group. McClean said he is now anticipating a wave of 300-mm fab announcements in the next several months. "IBM has said it does not want to be among the last to build 200-mm fabs, and in a couple of months it will announce its 300-mm fab," said the Scottsdale, Ariz.-based analyst. Two weeks ago, silicon foundry United Microelectronics Corp. of Taiwan announced it was accelerating and expanding its efforts in 12-inch wafer fabs by creating a joint venture with Hitachi Ltd. in Japan. The 300-mm venture is expected to quickly equip a building owned by Hitachi to begin production early next year. In Taiwan, UMC also plans to begin production in a wholly-owned 300-mm fab during the second half of 2001. "If things go extremely well with the Hitachi joint venture, we could pull up the schedule for the Tainan fab [in southern Taiwan] to mid-2001," said Jim Kupec, manager of worldwide marketing and sales at UMC. TSMC has also broken ground for its first 300-mm in Hsinchu, Taiwan. The facility is expected to be in production by early 2002. Pawlik said other new and planned 8-inch wafer fabs in Taiwan could be converted into 300-mm facilities if more silicon capacity was needed in the middle of the decade. For the current recovery cycle, Taiwan's TSMC and UMC are unquestionably the most aggressive spenders on new fab capacity. Both are planning to spend more than $2 billion in 2000 to increase wafer processing as demand grows. The foundries are also now attempting to lure fab-operating integrated device manufacturers (IDMs), which are beginning to outsource more of their capacity. "The foundries did not hesitate to start spending last year," McClean said. "They are in a race to convince the IDMs to not put in that next fab for themselves." McClean sees the foundry companies growing their share of processed semiconductors from 13% in 1999 to 18% in 2000, accounting for 8.4 million eight-inch equivalent wafers out of the industry's 47.8 million total. In 1998, foundries manufactured just 8%--or 3.5 million wafers--out of the industry's 43.9 million wafers, he said. And as wafer diameters grow, so does the foundry business. Dedicated foundries were processing 6% of the industry's 6-inch wafers for CMOS devices, said TSMC's Pawlik. Foundries are processing about 14% of the 8-inch wafers today, he said. "Once 12-inch is in place, foundries could have 30% to 50% the capacity," Pawlik predicted.