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To: Mr Metals who wrote (19823)1/12/2000 10:36:00 AM
From: Jim Bishop  Read Replies (1) | Respond to of 150070
 
SITK hmmm I already own a few hundred of SITK, what do you hear?

And that last little 300 was mine, on this news.

SITEK Incorporated Introduces a New High-Performance
Chemical-Mechanical-Planarization (CMP) Wafer Carrier

The Corona Retrofitable Wafer Carrier Provides Greatly Improved Throughput, Uniformity and Substantial Reduction in
Wafer Processing Costs

TEMPE, Ariz., Jan. 12 /PRNewswire/ -- SITEK Inc. (OTC Bulletin Board: SITK - news), a provider of engineering and manufacturing solutions to the
semiconductor industry, today unveiled the ''Corona'' Polishing Head(TM) a high-performance chemical mechanical planarization (CMP) wafer carrier designed to
retrofit onto existing 372/472 CMP tools in the field. Boasting the industry's best price-to-performance ratio, the Corona offers better overall performance than that
of the highest performance polishing heads on the market at a cost comparable to mid-range performance polishing heads.

The Corona Polishing Head has been under development for the past year and has successfully demonstrated improved CMP non-uniformity's at less than 4%
across a 200 mm wafer to an edge exclusion of 3mm. The head has demonstrated improved uniformities at oxide removal rates of more than 4,000 A/minute on
standard oxide films and at least an 80% increase in throughput performance for all types of oxide films. This has been accomplished using standard slurries, films,
pads and pressure on the wafer. This performance reduces the CMP cost per wafer pass as much as 40% and can substantially increase the useful life of CMP tools
now in production. SITEK estimates that due to the substantial improvement in product uniformity and machine throughput, the Corona Polishing head will save
customers well over $1,000,000 per system, per year.

According to Dr. Don Jackson, President and CEO of SITEK, former President of ASM/America and IPEC, ''We have leveraged our technology leadership to
deliver an entirely new wafer carrier that meets the most stringent wafer processing requirements at increased material removal rates. The Corona Head will extend
the life of existing 372 and 472 systems in use around the world and gives the industry a cost-effective solution to their CMP needs without their having to make
major capital investments or installations. Offering substantially improved throughput and potentially improved wafer yields, the Corona Head cost model shows that
the potential payback for the investment is less than three months. The increase in performance of a standard tool now in production brings it into the operating
region of newer, more expensive tools now in the market.''

Installation time for the Corona Head Kit by SITEK field engineers is less than one day with no mandatory alteration to the machine control software. The Corona
Polishing Head is also compatible with installed metrology systems.

About SITEK Incorporated

SITEK, through its operating subsidiaries and divisions, specializes in providing technical and manufacturing solutions to the semiconductor electronics industry. The
Company's broad range of products and services include the design and manufacture of next-generation semiconductor equipment including CMP systems, diffusion
and other high temperature systems, ultra- high purity gas delivery systems, and Magnetic Anneal systems. SITEK also specializes in the sale of pre-owned
semiconductor equipment and advanced manufacturing system automation. The company also provides value-added processing of silicon wafers and semiconductor
engineering and technical services. For more information please call (480) 431-0444 or visit SITEK's Web site at www.SITEKgroup.com.

This news release may include statements that constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995.
Please be cautioned that any such forward-looking statements are not guarantees of future performance and involve significant risks and uncertainties, and that actual
results may vary materially from those in the forward-looking statements as a result of any number of factors, including the risk factors contained in the Company's
disclosure documents.

Trademark Notice: All trademarks named above are the property of their respective holders.

SOURCE: SITEK Inc.

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