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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: greg nus who wrote (86748)	1/12/2000 4:15:00 PM
From: Tenchusatsu	Read Replies (2) \| Respond to of 1576830

Greg nus, re: manufacturing capacity, fabs, 1) <what is your % estimate of increased capacity effect the pizza hut wafers and .18 process will have on Intel's capacity?> Going from 0.25u to 0.18u translates roughly to a doubling of transistor densities. Then going from 200mm to 300mm wafers roughly doubles the number of dies that can fit onto one wafer. Finally, going from 0.18u to 0.13u once again doubles the transistor density. So if the processor core designs stayed the same, a 300mm wafer on the 0.13u process would hold eight times as many dies as a 200mm wafer on the 0.25u process. On the other hand, newer processors will always have many uses for the extra silicon, such as on-die caches and PCOAC-style integration. <Also is this why Intel is not building additional fabs. Aslo what is the status of the FT worth FAB which was mothballed?> I don't know anything about Intel's plans for future fabs. Last thing I heard about the fab in Fort Worth was that Intel has already resumed construction there after the semiconductor slowdown of 1998 disappeared. Tenchusatsu