Another design win for AMD
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Mobile AMD-K6-2-P Processor to Power NEC Notebook PCs; Commercial and Consumer Models Offered
Business Editors/High-Tech Writers
SUNNYVALE, Calif.--(BUSINESS WIRE)--Jan. 24, 2000--AMD today announced another design win for its Mobile AMD-K6(R)-2-P processor.
NEC Corporation has chosen the 400MHz Mobile AMD-K6-2-P processor to power a range of new notebook PCs, the VersaPro R series for the Japanese commercial market, and the LaVie U series for the Japanese consumer market.
"AMD is extremely pleased to be working with NEC," said Dana Krelle, vice president of marketing, for AMD's Computation Products Group. "These new NEC notebooks further strengthen our position in the important Japanese notebook PC market."
The VersaPro R is a series of notebook PCs aimed at corporate users, targeting large corporations contemplating high-volume purchases, as well as SOHO corporate users for whom price is a major factor. Sporting a new light silver body and 12.1-inch TFT LC display, the VersaPro features a one-touch start button for Internet and email use, and comes equipped with two USB ports. Standard features include an internal floppy disk drive, internal CD-ROM drive and internal battery, and a model with internal LAN, to meet the high needs of corporate users.
The LaVie U series, aimed at the consumer market, also features a one-touch button for Internet and email use. Standard features include a FAX modem, internal CD-ROM drive and internal battery, and two USB ports.
Both series are scheduled to ship in Japan, Feb. 4, 2000. NEC is also planning to ship mobile AMD-K6-2-P-based notebook PCs outside Japan.
About The Mobile AMD-K6(R)-2-P Processor Family
The Mobile AMD-K6-2-P processor with 3DNow!(TM) technology delivers excellent performance for today's demanding Microsoft(R) Windows(R) compatible office applications. The 9.3-million-transistor Mobile AMD-K6-2-P processor is manufactured on AMD's 0.25-micron, five-layer-metal process technology using local interconnect and shallow trench isolation at AMD's Fab 25 wafer fabrication facility in Austin, Texas. The Mobile AMD-K6-2-P processor is packaged in a Super7(TM) platform-compatible, 321-ceramic pin grid array (CPGA) package using C4 flip-clip interconnection technology.
About 3DNow!(TM) Technology
3DNow! technology, developed by AMD, was the first innovation to the x86 architecture that significantly enhanced floating-point-intensive 3D graphics and multimedia applications. It uses single instruction multiple data (SIMD) and other performance enhancements to provide a compelling visual computing experience.
The worldwide installed base of 3DNow! technology-enhanced PCs has grown to more than 20 million desktop and notebook systems. Support for 3DNow! technology exists today in leading industry-standard application programming interfaces (APIs), including Microsoft's DirectX 6.x and SGI's OpenGL APIs. In addition, numerous hardware and software products have been optimized for 3DNow! technology.
For a detailed list of hardware and software products that support 3DNow! technology, visit the AMD web site at www1.amd.com. Leading software titles optimized for 3DNow! technology are available online at the 3DNow! Technology Aisle on Chumbo.com.
About AMD
AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets. AMD produces processors, flash memories and products for communications and networking applications. AMD processors, including the AMD-K6-2, AMD-K6-III and AMD Athlon(TM) product families, power computers manufactured by nine of the Top 10 computer OEMs worldwide, including Compaq, HP, NEC, Fujitsu and IBM. AMD's mobile processors are used in more than 50 percent of notebook computers sold in the U.S. retail market to consumers and small businesses. Founded in 1969 and based in Sunnyvale, AMD had revenues of $2.9 billion in 1999. (NYSE:AMD).
Cautionary Statement
This release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are generally preceded by words such as "plans," "expects," "believes," "anticipates," "contemplates," or "intends." Investors are cautioned that all forward-looking statements in this release involve risks and uncertainty that could cause actual results to differ materially from the current expectations. Forward-looking statements in this release include the risk that shipments of NEC PCs using AMD-K6-2-P processors may be delayed or not occur at all, and that corporations and consumers will not make high-volume purchases of the NEC PCs using AMD-K6-2-P processors. We urge investors to review in detail the risks and uncertainties in the company's filings with the Securities Exchange Commission.
Note to Editors: AMD, the AMD logo, AMD Athlon, AMD-K6 and combinations thereof, Super7, 3DNow! and K6 are trademarks or registered trademarks of Advanced Micro Devices, Inc.
Microsoft and Windows are registered trademarks of Microsoft Corporation.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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CONTACT: AMD Public Relations, Sunnyvale
Kerry Elliott, 408/749-2920 (PR) |
