Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Process Boy who wrote (89874)	1/26/2000 11:13:00 PM
From: Bill Jackson	Read Replies (3) \| Respond to of 1570343

PB, Why then introduce them at all???? ...why to try and look like they had one when they did not. Bill

To: Process Boy who wrote (89874)	1/27/2000 12:11:00 AM
From: milo_morai	Read Replies (1) \| Respond to of 1570343

Dell said they cannot deliver 800Mhz till March 9. Thats almost the END of the QUARTER that doesn't fit with what you say below: and did INTC release the 800Mhz on Dec 30th?NO. I thought it was before Xmas on the 20th? Oh my that's 37 days ago and Dell is shipping in another 45 days from today!!! Problems out not solved until day 82 from the release date. INTC 800Mhz press release yahoo.cnet.com Sorry to Say PB but your explaination just plain stinks Milo Message #89874 from Process Boy at Jan 26 2000 9:58PM Bill, clip of article: Intel said when they intro'd the 800 4 weeks ago that supplies would be tight for the first part of the quarter. PB "A call placed to Dell showed that a Dimension PC with an 800MHz Pentium III processor, Intel's 820 chip set and 128MB of Rambus dynamic RAM, would not ship until March 9. Desktops Product Guide CPUs Briefing Center Test Your PC's Performance Systems Utilities Downloads Intel expects that its newest fabrication plant (to be called Fab 22), along with $800 million worth of its updates to its Hudson, Mass., fab, should help ease its supply situation in the long run. Short-term relief should come from conversion of the company's New Mexico-based Fab 11 to manufacture processors on Intel's 0.18-micron process. This should be complete by the end of this quarter, High said. Fab 22 will be Intel's first fabrication plant to use 300mm wafers. The wafers, 12-inches in width, should yield about 2.25 times more chips than the current 200mm or 8-inch wafers used by Intel. "It should crank somewhere between 35,000 and 40,000 wafers per month," High said. The actual number of chips on each wafer depends on the kind of processor being manufactured. A single wafer would yield more mobile chips, for example, than higher-end Itanium chips, because the Itanium will be physically larger. Packaging woes While the improvements will give the company a needed boost in manufacturing capacity, that capacity may not be the only answer to supply issues. Intel, sources said, is experiencing problems transitioning its Pentium III processor to a different package, called "flip chip." It appears that the packaging, delivered to Intel from an outside firm, has been delayed for some versions of the chip. The package mounts the chip on top of a board, whose back side sprouts 370 pins, allowing the chip to be mounted to Intel's Socket 370. Celeron processors have been using this type of packaging since last year. Quotes delayed by 20 minutes or more. While the packaging technique itself is not new, it is being employed by Intel for the first time on the latest-generation Pentium III "Coppermine" processors, aimed at small-form-factor PCs. Intel officials refused to comment directly on the packaging situation. They did say, however, that the company is shipping Pentium III at 500MHz and 550MHz with the 'flip chip' packaging. Supply of those chips, however, is also tight. Intel's High said he was not aware of packaging problems with the Pentium III. He said reports of the issue likely stemmed from shortages related to demand. On Fab 22 Fab 22, located in Chandler, Ariz., will not only be Intel's first to utilize 300mm wafers, it will also be the company's first to deliver its 0.13-micron manufacturing process and copper metalization. Copper metalization changes the interconnects that link transistors inside a chip from aluminum to copper, yielding a performance increase. Fab 22 will come online in 2001 using 200mm wafers, but quickly transition to 300mm. It will manufacture mobile, desktop and Intel's forthcoming IA-64, or Itanium, processors. "It should be a significant productivity improvement. ... We'd expect to save about 30 percent as opposed to building chips on a 200mm wafer," High said. Intel now has 14 fabrication plants in operation zdnet.com