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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: steve harris who wrote (90379)	1/29/2000 11:42:00 AM
From: Dan3	Read Replies (2) \| Respond to of 1571985

Re: Fab 22, located in Chandler, Ariz., will not only be Intel's first to utilize 300mm wafers, it will also be the company's first to deliver its 0.13-micron manufacturing process and copper metalization. Copper metalization changes the interconnects that link transistors inside a chip from aluminum to copper, yielding a performance increase. I can't get a response from eetimes or ebnonline right now (looks like SI isn't the only site that has problems sometimes!) but I recall seeing articles about 300mm aluminum wafers being tough to polish (that's a wide surface to keep perfectly flat) and that even 200mm copper wafers are hard to polish (since copper is such a soft metal). Any chance Intel will have a problem doing a simultaneous transition to copper, .13, and 300mm wafers? Pokey old AMD, taking those steps one at a time. Dan