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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Elmer who wrote (90398)	1/29/2000 10:13:00 PM
From: Process Boy	Respond to of 1572106

Elmer - <Sure they'll have problems. Everybody has problems but they will also be bringing that process up on 8 inch wafers as well. I'd like to hear PB's comments on 300mm wafers and Intel's "copy exactly" philosophy.> Actually, I do have a comment. The Intel press releases are some what inaccurate, IMHO (uh oh, straying from the "party line :-)). Intel's first 300mm fab is located in Oregon, is already constructed, and development activities are under way. It will be years before production 300mm will make it to the market place. It takes years to develop and characterize processes on a new generation of Si. Tools are new, distance across the wafer induces all sorts of unknown topographical issues, etc. Intel will not be tackling both .13 and 300mm at the same time. .13 development on 200mm will be done first, with subsequent conversion of the technology to 300mm in the Oregon fab. Once that is deemed transferable, F22 will become the first full fledged 300mm production facility. Also, the Oregon fab will ultimately (probably, that is) be deemed a production facility, but this is a long ways out. PB