QUALCOMM DELIVERS MSM 5000 CHIPSET WORLDS FIRST OF THE THIRD GENERATION SYSTEMS February 01, 2000 07:46
QUALCOMM CDMA Technologies Delivers World's First 3G CDMA
Chipset and System Software Solution for Handsets
- MSM5000 Solution Paves the Way for Early Development of Next-Generation Wireless Systems with
Initial Data Rates of 153 kbps -
SAN DIEGO, Feb. 1 /PRNewswire/ -- QUALCOMM Incorporated (Nasdaq: QCOM), pioneer and world leader
of Code Division Multiple Access (CDMA) digital wireless technology, today announced the on-time
shipment of chip samples and system software for the MSM5000(TM) Mobile Station Modem (MSM(TM)).
This product is the world's first 3G CDMA 1x Multi-Carrier (MC) solution for CDMA handsets that is
compliant with the 3G standard as specified by the International Telecommunications Union (ITU). The
sample shipments of the MSM5000 solution began at the end of January of this year and worldwide field
trials are expected to begin by late March of this year by QUALCOMM, manufacturers and carriers. The
MSM5000 chipset and system software will allow manufacturers to design the first 3G handsets that, in
addition to offering a rich application and feature-set in very small form-factors, also provide longer standby
times and higher data rate capabilities.
"Our on-time delivery of the world's first 3G chipset and system software solution strengthens
QUALCOMM's ongoing leadership in wireless technology and our commitment to help manufacturers begin
immediate development of 3G handset products," said Don Schrock, president of QUALCOMM CDMA
Technologies. "QUALCOMM's MSM5000 solution enables the fastest and easiest possible migration path
from IS-95A/B to 3G 1x technology to help accelerate wireless communications."
The MSM5000 solution, QUALCOMM's 3G 1x chipset and system software, is pin-compatible with the
MSM3000(TM) chip and its software architecture. Pin-compatibility will allow the 29 handset manufacturers
using the MSM3000 to introduce 3G handsets rapidly by reusing existing handset designs and software
applications. In delivering the MSM5000 solution, QUALCOMM has exceeded the ITU's 3G requirements for
data rates in full wide area mobility of 144 kilobits per second (kbps) by enabling data rates of 153.6 kbps
on both the forward and reverse links. The MSM5000 solution gives operators up to twice the overall
capacity over IS-95A and IS-95B systems by providing features such as fast 800 Hz forward power control
and new modulation and coding schemes. Significant standby time improvements in MSM5000-based
handsets will also be achieved through the use of the new Quick Paging Channel.
The MSM5000 chipset and system software is also fully backward compatible with existing IS-95A and
IS-95B networks, providing a seamless migration path to 3G while maintaining existing wide area coverage
for all subscribers. The MSM5000 system software will also include support for packet data, a full Internet
protocol suite, voice recognition and many other features.
"In accordance with our announced product plans, QUALCOMM CDMA Technologies will continue to
support both Multi-Carrier (MC) and Direct Spread (DS) modes of the ITU 3G specification, as well as our
High Data Rate (HDR) technology for optimized fast wireless Internet access," said Johan Lodenius, vice
president of marketing and product management for QUALCOMM CDMA Technologies. "By leveraging our
expertise in designing technology solutions for CDMA, wireless Internet and multimedia applications, we
will keep our customers in a leading position in the race to develop next-generation wireless products and
applications."
QUALCOMM CDMA Technologies (QCT) is the leading developer and supplier of CDMA chipsets, hardware
and software solutions, and tools with more than 200 million chips shipped worldwide. QCT supplies
chipsets to the world's leading CDMA handset and infrastructure manufacturers, including: Acer
Peripherals, Inc., ALPS ELECTRIC CO., LTD.; CASIO COMPUTER CO., LTD.; DENSO CORPORATION;
FUJITSU LIMITED; Hitachi, Ltd.; Hyundai Electronics Industries Co., Ltd.; KYOCERA CORPORATION; LG
Information and Communications, Ltd.; Samsung Electronics Ltd.; SANYO Electric Co., Ltd.; and Toshiba
Corporation, among others.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital
wireless communications products and services based on the Company's CDMA digital technology. The
Company's business areas include integrated CDMA chipsets and system software; technology licensing;
Eudora(R) email software for Windows(R) and Macintosh(R) computing platforms; and satellite-based
systems including OmniTRACS(R) and portions of the Globalstar(TM) system. Headquartered in San Diego,
Calif., QUALCOMM is included in the S&P 500 Index and is a 1999 FORTUNE 500(R) company traded on
the Nasdaq under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking
statements that are subject to risks and uncertainties, including timely product development, the
Company's ability to successfully manufacture significant quantities of CDMA or other equipment on a
timely and profitable basis, and those related to performance guarantees, change in economic conditions of
the various markets the Company serves, as well as the other risks detailed from time to time in the
Company's SEC reports, including the report on Form 10-K for the year ended September 26, 1999, and
most recent Form 10-Q.
QUALCOMM, OmniTRACS and Eudora are registered trademarks of QUALCOMM Incorporated. MSM,
MSM3000 and MSM5000 are trademarks of QUALCOMM Incorporated. Globalstar is a trademark of Loral
QUALCOMM Satellite Services, Incorporated. Windows is a registered trademark of Microsoft Corp.
Macintosh is a registered trademark of Apple Computer Inc. All other trademarks are the property of their
respective owners.
SOURCE QUALCOMM Incorporated
/CONTACT: Anita Hix, CDMA Technologies Public Relations, 858-658-5879,
fax: 858-651-7385, ahix@qualcomm.com, or Christine Trimble, Corporate Public
Relations, 858-651-3628, fax: 858-651-2590, ctrimble@qualcomm.com, or Julie
Cunningham, Investor Relations, 858-658-4224, fax: 858-651-9303,
jcunningham@qualcomm.com, all of QUALCOMM/
/Web site: qualcomm.com
(QCOM)
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