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To: Eric Jacobson who wrote (17684)	2/10/2000 7:09:00 PM
From: Uncle Frank	Read Replies (1) \| Respond to of 54805

>> Theoretically, 3 inch SiC wafers can more than double the number of chips per wafer over existing 2 inch technology. This is expected to significantly reduce the cost of devices made from SiC and has the potential to enable the company to increase volume to meet the high demand for its products. A 3" wafer has 2.25 times the surface area of a 2" wafer. Provided yield levels are maintained, which is largely a function of frequency of occurrence of crystal lattice defects, you could realize a 125% increase in throughput. uf