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Technology Stocks : RAMBUS (Nasdaq: RMBS) - THE EAGLE -- Ignore unavailable to you. Want to Upgrade?

To: Glenn Norman who wrote (1059)	2/15/2000 7:28:00 PM
From: Estephen	Read Replies (1) \| Respond to of 2039

Did you see the piece on the other board that shows motoral and lucent using rambus/pentium configurations in their teleco sets.? Message 12880058 Show Match Date: 02/15 08:04 EST RadiSys Offers Increased Bandwidth With Its Dual-Processor Solution PALM SPRINGS, Calif., Feb 15, 2000 (BUSINESS WIRE) -- RadiSys Corp. (Nasdaq:RSYS), a leading global designer and manufacturer of embedded computing solutions used by OEMs in the telecommunications, automation and other industries, launched its dual-processor, RDRAM-based solution at the Intel Developer Forum, Feb. 15 - 17. Designed for high-bandwidth applications in the telecom, Internet, medical imaging, and embedded arenas, RadiSys' latest solution combines two Intel(R) Pentium(R) III processors in the Flip Chip Pin Grid Array (FCPGA) package, the Intel 840 chipset and up to 2GB RDRAM. The result is a dual board computer with increased levels of performance, scalability and end-user productivity. RadiSys is one of the first manufacturers in the PCI/ISA market to offer a dual-board computer utilizing two of Intel's Pentium III processors in the FCPGA package. The Pentium III processor in the FCPGA package allows for small form factor and low profile designs. This is especially important in rack mounted environments where board height is critical. The increased bandwidth, found on this solution, is made possible with the aid of the RDRAM Memory and the 66MHZ PCI-64 interface. This lets the Intel 840 chipset extract the full potential of the Pentium III processor, thereby increasing system throughput. *************************************8 Lucent Technologies Selects RadiSys' CompactPCI Solutions for Its Next-Generation Enhanced Services Platform HILLSBORO, Ore., Feb 15, 2000 (BUSINESS WIRE) -- RadiSys Corp. (Nasdaq:RSYS), a leading global designer and manufacturer of embedded computing solutions used by OEMs in the telecommunications, automation and other industries, announced Lucent Technologies (NYSE:LU) will use RadiSys' technology in its new line of next-generation enhanced services platforms. Lucent will be integrating three of RadiSys' CompactPCI(R) perfect-fit solutions into its new Enhanced Media Resource Server (eMRS). The first RadiSys solution, acting as the shelf manager in the eMRS, is a CompactPCI CPU. This CPU solution combines two Intel(R) Pentium(R) III processors in the Flip Chip Pin Grid Array (FCPGA) package, the Intel BX chipset and up to 1G RDRAM. The result is a CPU solution with increased levels of performance, scalability and end-user productivity, designed for high-bandwidth applications in the telecom and Internet arenas. *************************************************** Date: 02/15 15:31 EST Motorola Computer Group Introduces a Dual Processor ATX Board and a Single Slot CompactPCI Board Using Intel Pentium III Processor for the PGA370 Socket TEMPE, Ariz., Feb 15, 2000 (BUSINESS WIRE) -- High Performance and Long-Life Embedded Platforms for OEMs Now Available Motorola Computer Group (MCG), the world's leading supplier of embedded computing platforms for Original Equipment Manufacturers (OEMs), Tuesday introduced two new products that support the Intel(R) Pentium(R) III processor for the PGA370 socket and Intel(R) 840 chipset. MCG is part of Motorola's Integrated Electronics Systems Sector (IESS), a division of Motorola Inc. (NYSE: MOT). The new PATX5000 motherboard is a dual processor design that supports the Pentium(R) III processors in a new package known as flip-chip pin grid array, or FC-PGA, package and 840 chipset. The 840 chipset supports Symmetrical Multiprocessing (SMP) and dual RAMbus memory each providing up to 400 MHz bus speed. This motherboard brings the benefits of a socketed dual processor configuration, dual RDRAM memory channels, and a high-level of integration within the small footprint of an ATX motherboard. It is designed for high-speed embedded applications in industries such as data communications, telecommunications, industrial automation, and imaging.