To: Robert Sheldon who wrote (1931 ) 2/18/2000 1:32:00 AM From: pat mudge Read Replies (1) | Respond to of 2702
Check Kopin's earnings:newsalert.com <<< In the fourth quarter, Kopin experienced continued sales growth for its HBT transistors, which are used to produce power amplifier circuits for CDMA, TDMA and GSM digital cellular and PCS handsets, as well as circuits for broadband OC-48 and OC-192 SONET systems. In November 1999, Kopin announced that Mitsubishi Electric Corp. was using Kopin's HBT transistor wafers for power amplifiers in Mitsubishi's GSM (Global System for Mobile) digital phones. Dr. Fan continued, "During the quarter, we commenced volume shipments to Mitsubishi Electric Corp., which is now using Kopin's HBT transistors for its new GSM power amplifiers. This is an important win, demonstrating that our HBT transistors are well suited for the GSM standard, as well as the CDMA standard." During the fourth quarter, Kopin continued to expand its GaAs HBT capacity. The expansion involves the installation of six new production systems by the end of March 2000 that will quadruple the company's capacity to produce heterojunction bipolar transistors. In December, the Company began shipping sample 6-inch InGaP and AlGaAs HBT transistor wafers from its new, high volume production systems. This new production platform provides high volume support for 6-inch telecom circuit production programs that will begin in 2000. Two such new systems are presently in place at Kopin. In January 2000, Kopin ordered eight additional HBT production systems, which will be delivered in calendar year 2000. "Demand for our HBT transistors is surging," Dr. Fan added. "As a result, it is critical that we invest aggressively to expand our capacity. In addition to acquiring and installing new systems and transitioning to six-inch wafer platforms, we are evaluating additional manufacturing locations that will enable us to handle our expected requirements beyond next year. By the end of 2000, we anticipate our HBT wafer output potential will be more than 300,000 4-inch wafers."