Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: tejek who wrote (94799)	2/23/2000 1:41:00 PM
From: Katherine Derbyshire	Respond to of 1572371

>>Katherine, are you suggesting that the polishing problems with copper can't be overcome?<< No. I'm saying that process engineers will have to balance the polishing parameters (pressure, slurry, rate, etc.) in order to achieve an optimal balance among throughput, uniformity, yield, device characteristics, etc. This is the same balancing act that occurs in all processing steps, but since copper and CMP are both new an established set of "right answers" doesn't yet exist. Katherine