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Technology Stocks : Cymer (CYMI) -- Ignore unavailable to you. Want to Upgrade?


To: Curlton Latts who wrote (24331)2/24/2000 8:06:00 PM
From: Tsaen Wang  Read Replies (1) | Respond to of 25960
 
Maybe this explain the after market activities, but
we aren't suppose to be in the known any way.

Canon revs up throughput of 248-nm scanner for 0.15-micron ICs

204.247.196.14



To: Curlton Latts who wrote (24331)2/24/2000 11:59:00 PM
From: Dale Knipschield  Read Replies (1) | Respond to of 25960
 
Curly,

<Sittin is the key. Sittin tight.>

Or buying more CYMI....especially at these discounted prices.

Check out the following article. (Sorry if its been posted before.)

edtn.com

We've had some posts here suggesting that LP has been making some inroads (Heaven forbid!) into CYMER's territory, selling a handful or so of lasers. My viewpoint is that competition is probably good for everyone, although it may reduce margins somewhat. However, based upon articles such as the above, IMO, laser demand is increasing to the point that we are looking at a win-win situation for all players, ESPECIALLY CYMER. And I doubt if ASP's will come DOWN in a surging equipment market like this.

Adding to CYMI in the mid 50's.......

Regards,

Knip



To: Curlton Latts who wrote (24331)2/25/2000 10:55:00 AM
From: BillyG  Respond to of 25960
 
Corning, Photronics to develop next-generation photoblanks
semibiznews.com

Semiconductor Business News
(02/24/00, 03:46:54 PM EDT)

CORNING, N.Y.--Corning Inc. and Photronics Inc. have entered into a two-year
development agreement to create next-generation photoblanks for
photolithography steps in wafer fabs.

"The technology we are developing will allow semiconductor manufacturers to
make a new generation of faster and more versatile chips," said Randall D. Price,
executive vice president at Corning Advanced Materials. "In particular, they will
enable manufacturers to use shorter wavelengths of ultraviolet light, called Deep
UV, to etch more intricate circuits onto silicon wafers."

Corning and Photronics estimate that the photoblank market will grow from $400
million today to $700 million by 2003. Corning entered the photomask business
last November with the introduction of HPFS glass substrates, which are
processed into photoblanks. The two companies estimate that the photomask
market will grow from about $2 billion today to approximately $4 billion by 2003.

"Meeting the need for such short wavelength lithography requires a combination of
advancedequipment, process technology, and new materials," said Steve Carlson,
vice president of technology at Photronics, a manufacturing of photomasks. "It's
the only way to reach the desired levels of circuit-pattern density and fidelity. Our
association with Corning will allow us to significantly add to the performance of
our Sub-Wavelength Reticle Solutions photomask product families," he added.



To: Curlton Latts who wrote (24331)2/25/2000 10:56:00 AM
From: BillyG  Respond to of 25960
 
IBM to disclose details of new photoresist for 0.10-micron processing
semibiznews.com

By Jack Robertson
Semiconductor Business News
(02/25/00, 10:13:04 AM EDT)

EAST FISHKILL, N.Y. -- IBM Corp.'s Microelectronics Division will tell the SPIE
Microlithography Conference next week in Santa Clara, Calif. that it has licensed
JSR Inc. of Japan to produce a new photoresist capable of taking 248-nanometer
exposure tools down to 0.10-micron processing.

George Gombo, manager of lithography at East Fishkill, said the Japanese firm is
expected to have the new resist on the market in the first half of this year. He said
IBM is already using the material extensively in its own chip operations. The new
resist uses bilayer imaging to extend the range of krypton fluoride (KrF) 248-nm
tools. Gombo said it is a silicon-containing resist with high etch resistive and
anti-reflective coating. He said the extreme 0.10-micron processing is for
application-specific circuits, but can be used for both memory and logic chips.

IBM will also provide more details at the SPIE meeting on its custom optics
system that is part of the cooperative development with Nikon Inc. for a
next-generation electron beam projection lithography system. Gombo said the
new high-emissive optic system has a large numerical aperture (NA) up to 0.7 and
supports a large area exposure for greater tool throughput.

A second paper will describe the projection reduction exposure technique using
variable immersive lenses. Gombo said this corrects a problem of electron-beam
exposure systems in which the electron beam width passing through the mask is
sometimes degraded by electron repulsion. The IBM optics minimize the electron
interaction with the mask and allow undistorted exposure on the wafer.

IBM will also provide the first details of e-beam mask developments coming from
its joint venture with Photronics Inc. (see July 12, 1999 story). Gombo said initial
research results on both membrane and stencil masks will be presented.

More about the Canon 248nm scanner....
semibiznews.com