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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Petz who wrote (95191)	2/25/2000 6:07:00 PM
From: Elmer	Read Replies (1) \| Respond to of 1574705

Re: "Seriously, can someone tell me to what extent CPU are tested before packaging? How many that pass the "before packaging" test FAIL the after-packaging test? Also, is FAB 12 one of those 10K wafer/week super fabs, of which Intel has two?" Assuming a modern top tier manufacturer, devices are tested quite extensively at wafer sort, including high frequency performance. What cannot be tested reliably is high temp performance. Although high temp testing is possible, there are problems associated with it and normally it is reserved for final test where you'd have to do it anyway. Other things not tested fully are tests which require the signal integrity of the connected wire bonds or C4 connections. Usually a low cause of fallout anyway. The percentages of good die out of wafer sort that die in the package because of either assembly related causes, burnin or the tests that could only be done after packaging is very small. I have seen yields above 99% for some products. Processors probably don't yield that high but they aren't as far behind as you might think. Oh and yes Fab12 is a megafab. EP