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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: Don Green who wrote (37705)	3/1/2000 1:37:00 AM
From: mishedlo	Read Replies (1) \| Respond to of 93625

Today's Zinger!!!! www2.marketwatch.com Tessera Announces New Process Delivering 50% Reduction in Rambus DRAM Packaging Costs TUESDAY, FEBRUARY 29 2000 9:13 PM EST YOKOHAMA, Japan, Feb 29, 2000 (BUSINESS WIRE) -- Tessera's Widely-Used CSP Technology Adopted by Rambus DRAM Manufacturers Tessera(R) Inc., the industry's leading provider and licensor of chip-scale packaging (CSP) technology, today announced a new manufacturing process that will drastically reduce the package assembly costs of Rambus(R) DRAMs and other integrated circuits. Tessera is unveiling its CSP cost reduction roadmap at the Rambus Memory Solution Forum 2000, taking place here March 1 and 2 at the Shin Yokohama Prince Hotel. Tessera's Zinger 4.0 process, a key element of the roadmap, is now in production and available to Tessera licensees worldwide. "The introduction of the Zinger 4.0 process is a key element in reducing the cost of assembling Rambus DRAMs," said Bruce McWilliams, president and CEO of Tessera. "Since Tessera's CSP technology is used by RDRAM manufacturers, the new process and Tessera's future cost reduction efforts will continue to help drive industry adoption of Rambus technology by further improving its affordability." Tessera's widely-used CSP technology is Rambus' reference package for RDRAM(R) devices because it is a high-performance, cost effective solution for high-speed data transfer between Rambus-compatible devices. Rambus' high-speed interface technology has already been adopted by industry leading computer and consumer companies, and the combination of Tessera's and Rambus' cost reduction efforts will help accelerate and broaden worldwide adoption. One particularly large market for Rambus technology is the consumer electronics market, dominated by leading Japanese companies. Rambus DRAMs incorporating Tessera's CSP technology are used in the Sony PlayStation(R)2 game console, and are expected to proliferate in other gaming platforms, digital TVs, set-top boxes and other applications that require high bandwidth memory interfaces. Tessera's new Zinger 4.0 process reduces the assembly costs of RDRAMs and other (mu)BGA packages by more than 50 percent over existing processes. The new process achieves these savings through a variety of cost-cutting measures, including more efficient use of the tab tape, the development of a new injection process, new automatic equipment for tape conversion, and improved equipment utilization. Combined, these actions reduce the amount of materials, length of time and number of steps needed for the (mu)BGA assembly process. "Tessera's high performance CSP technology helps meet the electrical performance required for the high bandwidth of RDRAMs," said Dr. Frank Fox, vice president of the Memory, Architecture, and Technology Division at Rambus Inc. "Tessera's CSP cost reduction efforts will go a long way in helping to drive down the cost and accelerate the adoption of Rambus technology." Tessera recently announced the next step in its cost reduction roadmap -- next generation WAVE(TM) (Wide Area Vertical Expansion) CSP technology. (Please see the WAVE release dated February 29.) About Tessera Inc. Tessera is the leading developer and licensor of chip-scale packaging technology to the semiconductor industry. The company's technology sets new standards in performance, reliability, size and cost, and is ideal for high performance and space-constrained applications such as wireless handsets, PCs, game consoles and other devices used to communicate and access the Internet. Tessera's flagship CSP technology, the (mu)BGA package, has been adopted as the de facto standard for a number of semiconductor applications. Tessera currently licenses its advanced packaging technology to over 30 assembly and semiconductor companies, including Amkor, ASE, AMD, ChipMOS, ChipPAC, EEMS, Hitachi, Hyundai, Infineon, Intel, IPAC, LG, Meicer, Mitsui, Samsung, Sharp, Shinko, Sony, SPIL, ST Microelectronics, Texas Instruments and Toshiba. Tessera is based in San Jose, Calif. Additional information is available at www.tessera.com . Note to Editors: Tessera, (mu)BGA and the Tessera logo are registered trademarks of Tessera, Inc. PlayStation is a registered trademark of Sony Computer Inc. Rambus and RDRAM are registered trademarks of Rambus Inc. All other brand and product names may be trademarks of their respective companies. Copyright (C) 2000 Business Wire. All rights reserved. Distributed via COMTEX. -0- CONTACT: The Hoffman Agency for Tessera Paul Barbieri, 408/286-2611 pbarbieri@hoffman.com WEB PAGE: businesswire.com GEOGRAPHY: CALIFORNIA INTERNATIONAL ASIA PACIFIC INDUSTRY CODE: HARDWARE MANUFACTURING COMPUTERS/ELECTRONICS ELECTRONIC GAMES/MULTIMEDIA PRODUCT Today's News On The Net - Business Wire's full file on the Internet with Hyperlinks to your home page.

To: Don Green who wrote (37705)	3/1/2000 9:02:00 AM
From: Jdaasoc	Read Replies (2) \| Respond to of 93625

Don: Most cost reductions in RDRAM off business wire Tessera Announces New Process Delivering 50% Reduction in Rambus DRAM Packaging Costs BUSINESS WIRE - February 29, 2000 21:13 YOKOHAMA, Japan, Feb 29, 2000 (BUSINESS WIRE) -- Tessera's Widely-Used CSP Technology Adopted by Rambus DRAM Manufacturers Tessera(R) Inc., the industry's leading provider and licensor of chip-scale packaging (CSP) technology, today announced a new manufacturing process that will drastically reduce the package assembly costs of Rambus(R) DRAMs and other integrated circuits. Tessera is unveiling its CSP cost reduction roadmap at the Rambus Memory Solution Forum 2000, taking place here March 1 and 2 at the Shin Yokohama Prince Hotel. Tessera's Zinger 4.0 process, a key element of the roadmap, is now in production and available to Tessera licensees worldwide. "The introduction of the Zinger 4.0 process is a key element in reducing the cost of assembling Rambus DRAMs," said Bruce McWilliams, president and CEO of Tessera. "Since Tessera's CSP technology is used by RDRAM manufacturers, the new process and Tessera's future cost reduction efforts will continue to help drive industry adoption of Rambus technology by further improving its affordability." Tessera's widely-used CSP technology is Rambus' reference package for RDRAM(R) devices because it is a high-performance, cost effective solution for high-speed data transfer between Rambus-compatible devices. Rambus' high-speed interface technology has already been adopted by industry leading computer and consumer companies, and the combination of Tessera's and Rambus' cost reduction efforts will help accelerate and broaden worldwide adoption. One particularly large market for Rambus technology is the consumer electronics market, dominated by leading Japanese companies. Rambus DRAMs incorporating Tessera's CSP technology are used in the Sony PlayStation(R)2 game console, and are expected to proliferate in other gaming platforms, digital TVs, set-top boxes and other applications that require high bandwidth memory interfaces. Tessera's new Zinger 4.0 process reduces the assembly costs of RDRAMs and other (mu)BGA packages by more than 50 percent over existing processes. The new process achieves these savings through a variety of cost-cutting measures, including more efficient use of the tab tape, the development of a new injection process, new automatic equipment for tape conversion, and improved equipment utilization. Combined, these actions reduce the amount of materials, length of time and number of steps needed for the (mu)BGA assembly process. "Tessera's high performance CSP technology helps meet the electrical performance required for the high bandwidth of RDRAMs," said Dr. Frank Fox, vice president of the Memory, Architecture, and Technology Division at Rambus Inc. "Tessera's CSP cost reduction efforts will go a long way in helping to drive down the cost and accelerate the adoption of Rambus technology." Tessera recently announced the next step in its cost reduction roadmap -- next generation WAVE(TM) (Wide Area Vertical Expansion) CSP technology. (Please see the WAVE release dated February 29.) About Tessera Inc. Tessera is the leading developer and licensor of chip-scale packaging technology to the semiconductor industry. The company's technology sets new standards in performance, reliability, size and cost, and is ideal for high performance and space-constrained applications such as wireless handsets, PCs, game consoles and other devices used to communicate and access the Internet. Tessera's flagship CSP technology, the (mu)BGA package, has been adopted as the de facto standard for a number of semiconductor applications. Tessera currently licenses its advanced packaging technology to over 30 assembly and semiconductor companies, including Amkor, ASE, AMD, ChipMOS, ChipPAC, EEMS, Hitachi, Hyundai, Infineon, Intel, IPAC, LG, Meicer, Mitsui, Samsung, Sharp, Shinko, Sony, SPIL, ST Microelectronics, Texas Instruments and Toshiba. Tessera is based in San Jose, Calif. Additional information is available at www.tessera.com. Note to Editors: Tessera, (mu)BGA and the Tessera logo are registered trademarks of Tessera, Inc. PlayStation is a registered trademark of Sony Computer Inc. Rambus and RDRAM are registered trademarks of Rambus Inc. All other brand and product names may be trademarks of their respective companies. Distributed via COMTEX. Copyright (C) 2000 Business Wire. All rights reserved.

To: Don Green who wrote (37705)	3/1/2000 11:52:00 PM
From: Manx	Read Replies (1) \| Respond to of 93625

1-GHz Pentium III computers coming this month By Michael Kanellos Staff Writer, CNET News.com March 1, 2000, 5:50 p.m. PT Consumers will likely be able to buy PCs containing 1-GHz chips later this month, a lurch forward in the release date of these systems, sources said today. Hewlett-Packard will start shipping consumer PCs containing Intel's Pentium III running at 1 GHz (1,000 megahertz) later this month, sources at HP said. Corporate computers containing these chips won't come out until June. Likewise, IBM is expected to make an announcement regarding 1-GHz systems next week, sources said. With the anticipation building around 1-GHz systems, consumers should be able to buy whatever computers are available soon after the shipping dates. The release of these computers could hand Intel a symbolic victory over rival Advanced Micro Devices. Since last August, when AMD first released its Athlon processor, the two companies have been engaged in a game of leapfrog with regard to chip speed. When AMD released a 750-MHz Athlon late last year, for instance, Intel accelerated the release of an 800-MHz Pentium III. AMD followed shortly afterward with an 850-MHz Athlon. Both companies have publicly said that their 1-GHz chips will come in the second half or the middle of this year. AMD has been able to speed up Athlon with relative ease, according to a number of analysts. Therefore, a counter-announcement that computer makers will release 1-GHz Athlon PCs in the near future wouldn't be a surprise. Although chip speeds have accelerated faster than expected because of the race, the competition has created supply problems. Consumers and dealers have complained for a number of months that they cannot find enough of Intel's fastest Pentium IIIs. AMD has faced similar, but not nearly as extensive, shortages at the top end of the Athlon line. The 1-GHz systems, therefore, could be a tight commodity. HP might start shipping these computers, but only a few customers will get their hands on them. Volume production and sales of 1-GHz Pentium III systems is expected by the third quarter, according to Howard High, an Intel spokesman. Another Intel spokesman said that systems will appear shortly. Of course, the value of these systems will be largely symbolic. Intel is still slated to come out with 866-MHz and a 933-MHz versions of the Pentium III. "No one is going to jump the gun on the 933-MHz," deadpanned Linley Gwennap, principal at the Linley Group, adding, "The big question is who needs a 1-GHz processor." At the Intel Developer Forum in Palm Springs in February, Intel showed off pre-production systems from Dell Computer, IBM and HP containing 1-GHz Pentium IIIs. Existence of pre-production computers means that 1-GHz chips exist and that all three companies have completed the basic design issues to produce 1-GHz systems commercially. In the second half of the year, Intel will introduce the "Willamette" processor, the successor to the Pentium III, according to Albert Yu, senior vice president at Intel. Willamette will come out at 1-GHz or faster. Willamette is the code-name for the chip. The final brand name will likely leverage the Pentium brand. Related news stories ? Intel hits 1.5-GHz mark in chip demonstration February 15, 2000 ? AMD snags speed crown from Intel February 11, 2000