Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Amkor Technology Inc (AMKR) -- Ignore unavailable to you. Want to Upgrade?

To: Jim Oravetz who wrote (598)	3/13/2000 1:19:00 PM
From: tech101	Read Replies (2) \| Respond to of 1056

New Target of 80 by SSB: messages.yahoo.com AMKR STILL CHEAP by: Aartvark (44/M/Atlanta, GA) 3/13/00 12:07 pm Msg: 11864 of 11870 Sollie Smith Barney this morning talking bullishly about Amkor after a very upbeat analyst meeting last Friday. Raised price target to $80 from $54. Talked about new products, Anam acquisitions, new foundry customers, outsourcing trends, company prospects etc. Consider the following valuations and decide for yourself where value/growth is: Price/00 EPS Price/01 EPS Amkor 30.2 22.1 ST Assemb 80.1 54.1 ASE Test 42.9 34.2 Chartered 119.1 54.7 Taiwan Semi 62.5 42.1 Average 67.0 41.0 SSB report says that Amkor should at least trade at 35x multiple 2001 EPS. Hence the $80 price target. Stock still has a lost of steam! They are rolling out new packaging products (SiPs). the second half is always stronger. Now you have to ask yourself: "what could go wrong for the trend to be broker?" Slow PC growth, not! slow internet growth, not! There is too much noise in the market. Stay focused!

To: Jim Oravetz who wrote (598)	3/16/2000 12:38:00 PM
From: Jim Oravetz	Read Replies (2) \| Respond to of 1056

BUSINESS WIRE)--March 16, 2000--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) and Amkor Technology, Inc. (NASDAQ: AMKR) today announced a 10-year technology transfer agreement between Amkor and Flip Chip Technologies, L.L.C. (FCT). Amkor, the world's largest provider of contract semiconductor packaging and test services, will use FCT's proprietary Flex-on-Cap (FOC) wafer bumping and redistribution (RDL) technologies to manufacture advanced flip chip IC packages for both performance and form factor driven applications. Amkor currently outsources wafer bumping for high-performance flip chip packages through FCT's Phoenix-based facilities. As recently announced, Amkor plans to add wafer bumping capability in its Korean manufacturing factory in response to growing demand for flip chip packages. The key elements of the technology transfer agreement will provide Amkor with future technology development, second sourcing, redistribution capability, and opportunities for cost and cycle time reduction by locating bump manufacturing close to the assembly and test production lines. Amkor selected FCT's FOC and RDL processes due to their proven track record with leading customers. This technology is the leading commercial solder bumping solution. Other advantages of the FCT solder paste deposition process include: control of the solder composition, "low alpha" processing, and its inherent extendibility to "lead-free" as well as 300 mm solutions. Outside of conventional bumping applications, the combination of RDL and FOC also enables certain wafer level CSP options for customers. According to Amkor Corporate Vice President of Operations Bruce Freyman, the FCT process is extremely cost-effective and delivers high yields. "Kulicke & Soffa has long been a key supplier of assembly equipment for wire bonded ICs, and we look forward to expanding our relationship to add FCT's technology to Amkor's portfolio of leading-edge packaging solutions," Freyman said. "We are pleased to conclude this licensing agreement with FCT, because it allows us to supply the same technology we have qualified for existing high performance flip chip packages now in production," said Richard Groover, Amkor vice president and chief technologist for flip-chip technology. "Amkor and FCT have collaborated on commercializing this technology. It is a key component of our flip chip packaging offering that supports our network, ASIC, and communications customers. We have utilized FCT's bumps since we qualified our state-of-the-art flip chip line in the Philippines. The process has been successfully applied to both flip chip CSP and HPBGA applications," added Groover. Wafer bumping and redistribution are two silicon wafer processes required for most flip chip packaging applications. These are key enabling technologies (as opposed to package types), and are the foundation of any solid flip chip manufacturing capability. FCT's FOC process has been in production at its Phoenix facility since 1996, and is considered one of the industry accepted solder bumping solutions. "FCT has provided Amkor wafer bumping services for the past two years and now offers this same technology for expansion to their internal manufacturing line," said Don May, K&S vice president for technology licensing. "The top three semiconductor assembly subcontractors have now licensed Flip Chip Technologies' wafer bumping process. This is further confirmation that FCT is the world's leading provider of wafer bumping technology." Based in Phoenix, AZ, FCT is an innovative, high-volume wafer bumping resource providing IC packaging services and expertise to the semiconductor industry. A joint venture of Kulicke & Soffa Industries and Delphi Delco Electronics Systems, FCT offers proven merchant wafer bumping services and technology licensing used in applications requiring higher performance, reduced form factor, and lower costs than those obtainable through other techniques. For more information on FCT visit www.flipchip.com Jim