Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Speedfam [SFAM] Lovers Unite ! -- Ignore unavailable to you. Want to Upgrade?

To: Daniel Simon who wrote (3542)	3/16/2000 10:51:00 PM
From: Donald Wennerstrom	Respond to of 3736

Hopefully, this will stir some positive interest tomorrow. SpeedFam-IPEC Receives Order for Next-Generation CMP System; Leading U.S. IC<p>Manufacturer to Act as Beta Site CHANDLER, Ariz., Mar 16, 2000 (BUSINESS WIRE) -- SpeedFam-IPEC, Inc. (Nasdaq:SFAM), a leading global supplier of high-throughput chemical mechanical planarization (CMP) systems with the world's largest installed base for the semiconductor industry, today announced it received an order for its next-generation orbital CMP polishing system from a leading semiconductor manufacturer in the United States. This manufacturer will act as the beta site for the system, which is slated for introduction later this year. The system will be used to manufacture ASIC products at the 0.18-micron design rule and will support both oxide and metal planarization process applications. The customer's decision to incorporate tools with greater flexibility and higher productivity prompted a multi-supplier evaluation that considered process capability, cost of ownership and total customer satisfaction. SpeedFam-IPEC's next-generation system was selected as the tool-of-choice overall. "Our next-generation products are being designed to meet our customers' rapidly changing process needs," stated Richard J. Faubert, president and chief executive officer of SpeedFam-IPEC. "This latest addition to our product line combines our field-proven orbital and rotational CMP technologies into a single platform. This first beta system is scheduled to ship next quarter with additional installations targeted at key customer sites in the second half of 2000." According to Greg Shepard, senior vice president of marketing at SpeedFam-IPEC, changing market requirements are driving the need for CMP platforms that exhibit superior flexibility and multi-recipe management with higher productivity. "As our customers move to smaller device geometries, we are committed to providing the maximum productivity capabilities and continually evolving our polishing systems to meet the demands of our global customers." The next-generation CMP system incorporates an advanced wafer carrier design, significantly enhanced polishing platen, increased reliability and improved cleaning capabilities that will continue to lower cost of ownership. The system also offers robust endpoint and process metrology capabilities superior to those currently available on the market, as well as being fully integrated with SpeedFam-IPEC's latest cleaning system that handles multiple interconnect processes including copper and tungsten. SpeedFam-IPEC, Inc. SpeedFam-IPEC, Inc. is a leading global supplier of chemical mechanical planarization (CMP) systems featuring the world's largest installed base. These systems are used in the fabrication of next-generation integrated circuits. The company also manufactures leading high-throughput precision surface processing systems for the thin film memory disk media, silicon wafer and general industrial applications markets. In addition, the company markets and distributes parts and consumables (slurry polishing liquids) for use in surface processing. SpeedFam-IPEC, Inc. owns a 50-percent interest in a joint venture, SpeedFam-IPEC Co., Ltd. (the Far East Joint Venture). This news release contains forward-looking statements. Actual results may vary. Orders in backlog may not result in future revenue if customers cancel or reschedule orders. The CMP market may not grow. In particular, the growth of the CMP market in Asia is uncertain. We may not be able to maintain or increase our share of the CMP market due to many factors. We may not be able to achieve the high levels of customer satisfaction to obtain repeat business from existing customers. We may not be successful in our efforts to develop new accounts. Competitive conditions in the industry and technological changes may affect the CMP equipment market. The markets for metal and oxide applications requiring line widths of 0.18 microns and below, and for copper and 300 mm process technologies, may not develop, or we may not be successful in developing these technologies, delivering to market products based on these technologies or generating revenue from these products. See SpeedFam-IPEC's, SpeedFam and IPEC's filings with the SEC, the Annual Report on Form 10-K filed on August 30, 1999; and the Quarterly Report on Form 10-Q filed on January 14, 2000, for additional risks affecting the company. Distributed via COMTEX. Copyright (C) 2000 Business Wire. All rights reserved.