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To: pompsander who wrote (38238)3/16/2000 1:06:00 PM
From: SC  Read Replies (2) | Respond to of 93625
 
Comments on Tom Pabst's latest article, anyone?
www7.tomshardware.com



To: pompsander who wrote (38238)3/16/2000 1:21:00 PM
From: George the Greek  Read Replies (1) | Respond to of 93625
 
re: BGA packaging

I'm not a packaging engineer, but it's only been around a few years, though not too long, by my recollection. Not just for RDRAM. Saves pin real estate around the edges of a chip package, and presents a rectilinear grid array of solder-bump style contacts on the bottom of the package for wave soldering directly to the printed circuit board. Also used in high-pincount ASICs, like in cellphones.

George


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