To: pompsander who wrote (38276 ) 3/17/2000 12:28:00 PM From: Don Green Read Replies (3) | Respond to of 93625
> Where is my LSI news? LSI Logic unveils flexible 0.13-micron process for communications ICs Semiconductor Business News (03/17/00, 08:49:02 AM EDT) PHOENIX--LSI Logic Corp. today disclosed a new "flexible" 0.13-micron process technology, called Gflx, which will have the capability to produce a range of highly integrated ICs for communications applications, including optical networks, wireless baseband processors, and digital line subscriber (xDSL) markets. Unveiled before a meeting with analysts in Phoenix, the new technology will produce 0.10-micron effective channel lengths with 0.13-micron drawn gates, and provide up to eight levels of metal interconnect, the Milpitas, Calif., company. The Gflx technology will produce 78 million usable logic gates, or about 612 million transistors, on a 20-by-20 mm chip, according to LSI Logic. The company is among the first to formally announce a 0.13-micron process technology. LSI Logic plans to begin shipping 0.13-micron prototype ICs in early 2001, and company officials said they have already begun working with customers to apply chip designs to the Gflx process. "Gflx provides us the flexibility to meet the next-generation requirements of system-on-a-chip, ASIC and standard products at a time when communications has clearly usurped the PC as the primary growth driver of the worldwide semiconductor industry," said Wilfred J. Corrigan, chairman, and chief executive officer of LSI Logic. "The ever-increasing demand for Internet bandwidth has caused suppliers of Internet infrastructure to integrate more functions onto a single chip, which makes Gflx an ideal solution." The Gflx technology will have eight different product modules to provide chip designers with a range of options and flexibility for speed and low power consumption. LSI Logic said the new technology will have the flexibility to operate at 650 MHz or run at a low power option of 8.5nW per megahertz per gate.low-power option at low power The eight modules are: high-performance and low-power transistors; 1.5- and 1.2-V core libraries; mixed-signal; application-optimized I/O sets; metal options ranging from four-to-eight layers; embedded SRAM ; and embedded FGPA. "Gflx is our most dynamic process technology, making it suitable for high-volume customers manufacturing either high performance products, as found in servers and in the broadband infrastructure, or for low-power solutions, such as in wireless handsets," said John Daane, executive vice president of LSI Logic's Communications Products Group. The technology will scheduled to be transferred to LSI Logic's wafer fab in Gresham, Ore., later this year. "Moving to the 0.10-micron [L-effective] technology generation demonstrates LSI Logic's commitment to being a process technology leader," said Joe Zelayeta, executive vice president of worldwide operations at LSI Logic. "Our state-of-the-art, high-volume Gresham wafer fabrication facility was designed to manufacture succeeding generations of process technologies. The global capacity crunch is especially acute in the lower geometries. LSI Logic not only has ample world class capacity, but also provides customers unprecedented flexibility with the Gflx process technology to optimize their end-market products."