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Technology Stocks : Dense Pac Microsystems (DPAC) -- Ignore unavailable to you. Want to Upgrade?

To: ccryder who wrote (592)	5/25/2000 12:54:00 PM
From: DEER HUNTER	Read Replies (1) \| Respond to of 619

Thursday May 25, 12:30 pm Eastern Time Company Press Release Dense-Pac Hires 25-Year Sales and Marketing Professional to Head Sales Effort Prior Toshiba and Integrated Device Technology Executive Joins Dense-Pac as Vice President of Sales GARDEN GROVE, Calif.--(BUSINESS WIRE)--May 25, 2000-- Dense-Pac Microsystems Inc. (Nasdaq:DPAC - news), a leading-edge provider of high-density semiconductor packaging solutions, Thursday announced the appointment of Mike Harkins as vice president of sales. Harkins has more than 25 years of sales and marketing management experience with Fortune 100 companies and start-ups, including Toshiba America, Hughes Aircraft, Rockwell International and Integrated Device Technology (Nasdaq:IDTI - news) in Santa Clara, Calif. Harkins most recently served as new business development senior manager for Integrated Device Technology (IDT), where he supervised the roll-out of a product family of high-speed semiconductor switches and logic. IDT is a provider of innovative semiconductor solutions to communication systems designers. Prior to IDT, he served as director of marketing and sales for North America and Europe for Tritech Microelectronics Inc., a semiconductor company specializing in mixed signal ASIC and PC audio products. Harkins holds a bachelor of science degree in physics from the University of California. Harkins joins Dense-Pac after a banner year of significant revenue and earnings growth. The company recently reported revenue growth for the previous fiscal year ended Feb. 29, 2000, of 118% with record profits. ``Mike's proven track record of successfully managing sales growth in the commercial marketplace, comes at a time when the coordination of our sales and marketing efforts is key to our future growth,'' stated Ted Bruce, Dense-Pac's president and chief executive officer. ``His experience in corporate planning coupled with domestic and international sales efforts will reinforce our revenue trends.'' Dense-Pac Microsystems is a technology company that specializes in the design of proprietary and patented three-dimensional high-density packaging. The products allow the company's commercial, industrial, defense and aerospace customers to pack large amounts of memory into small spaces. Its commercial products include applications such as network servers, computer storage devices and medical instrumentation. IDA can include airborne and space avionics and such diverse areas as space satellites and missiles and high-performance servers. The company Web site is at www.dense-pac.com. This news release includes forward-looking statements, including statements regarding the company's market, technology development, expansion and business plans, which are subject to change. The actual results may materially differ from those described in any forward- looking statement. Important factors that may cause actual results to differ are set forth in the company's periodic filing with the U.S. Securities and Exchange Commission including its Form 10-KSB for the year ended Feb. 28, 1999. -------------------------------------------------------------------------------- Contact: Dense-Pac Microsystems Inc., Garden Grove Yvonne Huff, 714/898-0007 (investor relations) E-mail: yvonneh@dense-pac.com or Wall Street Investor Relations Corp. Joe Zappulla, 301/907-4090 E-mail: JoeZ@WallStreetIR.com