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Technology Stocks : Amkor Technology Inc (AMKR) -- Ignore unavailable to you. Want to Upgrade?

To: Jim Oravetz who wrote (635)	4/12/2000 10:42:00 AM
From: Artslaw	Respond to of 1056

Credit Suisse First Boston started Amkor at Strong Buy: biz.yahoo.com - Amkor Technology Inc. (NasdaqNM:AMKR - news) was started at strong buy, with a 12-month price target of $80. Shares closed at 57-1/4 on Tuesday on the Nasdaq stock market. -- Earnings per share estimates for fiscal year 2000 are $1.20 a share, with the 20001 EPS estimate at $1.70. -- Amkor is the largest provider of subcontract packaging services for the semiconductor industry and is currently benefiting from both cyclical and secular trends in the packaging industry. Stock not moving much in response yet. . . Steve

To: Jim Oravetz who wrote (635)	4/13/2000 8:20:00 AM
From: Jim Oravetz	Read Replies (3) \| Respond to of 1056

Amkor, Zuken plan expert system tool for design of IC packages By Semiconductor Business News Apr 12, 2000 (5:57 AM) URL: semibiznews.com WEST CHESTER, Pa.-- Amkor Technology Inc. here today announced a partnership with design software supplier Zuken USA Inc. to streamline development of advanced IC packages , such as ball-grid arrays, chip-scale packages, flip-chip technology, multi-chip packages, and modules. Amkor said the partnership will develop an expert system-based design tool that uses a customer's electrical design requirements to rapidly create optimal IC package designs using the latest manufacturing design guidelines. The system will also produces all required documentation files for manufacturing. In doing so, the new design tool is expected to significantly shorten development cycles for advanced packages, and it will increase the chances of first-pass design success, said Amkor. A key feature in the new design software will be improved capability for wireless frequency analysis and auto-routing of advanced IC packages, said Amkor and Zuken, which was formally known as Zuken-Redac before the U.K.-based parent company changed its name in March. "Knowing customer needs, and the capabilities of the substrate suppliers and the assembly site, we can use this tool to achieve accurate designs ready for manufacturing with very short lead times," said Randy Holman, vice president of design services for Amkor. "This literally means we can go from concept to manufacturing in hours instead of weeks. That's a critical difference for many of our customers." The new tool will use information from the customer--such as die size, bond pad locations and netlists--to create an electronic design for the package. The output can then be transferred electronically to the suppliers, said the two partners. "It will enable Amkor to stay at the forefront of packaging design and will deliver the ultimate advanced IC packaging design solutions to the marketplace," said Paul Ewing, vice president of Zuken USA's North American operations. "The advanced technology included in this agreement assists Amkor in achieving a substantial increase in the number of designs that can be pushed through the package development cycle."