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To: mishedlo who wrote (39635)4/11/2000 8:40:00 PM
From: mishedlo  Read Replies (1) | Respond to of 93625
 
Dense-Pac sections I like best

"Consequently, inventory levels for certain memory chips were stockpiled in anticipation of a potential limited availability"

Dense-Pac's technology are gaining recognition, which is demonstrated in our expansion into new vertical markets, as we have recently done in the medical instrumentation industry."

"We have stepped up our research and development efforts to examine new applications for packaging technology in new fields, such as telecommunications, medical, routers, switches and supercomputers."

"We are in the process of filing new patent applications in new areas such as high-density package configuration, thermal high-density dissipation, chip scale packaging technology commonly used in Digital Signal Processors (DSP), Flash and RAMBUS(R) semiconductors, and we are hopeful that the patents will be granted."