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Technology Stocks : Rudolph Technologies Inc-(RTEC) -- Ignore unavailable to you. Want to Upgrade?

To: sam who wrote (12)	7/11/2000 12:53:43 PM
From: sam	Read Replies (1) \| Respond to of 106

Rudolph adds integrated film metrology tools for deposition, polishing steps Semiconductor Business News (07/10/00, 04:58:35 PM EDT) SAN FRANCISCO -- During the Semicon West trade show here today, Rudolph Technologies Inc. rolled out a couple of new real-time, integrated metrology systems for monitoring and control of opaque and transparent films used in a variety of wafer-processing applications. The new i-MP system is aimed at opaque film processing steps while the i-SL tool is for transparent films. Rudolph Technologies said the two new systems extend its real-time metrology technologies for integration with tools that perform deposition and wafer polishing steps. The two systems are intended to complement the company's stand-alone metrology systems in production fabs for full characterization of process results. The i-MP uses Rudolph's Pulse ultrasonic metal film thickness metrology capability to measure multiple metal film processes. The company said its non-destructive Pulse technology can monitor single- or multi-layer metal processes when integrated with tools performing chemical mechanical planarization (CMP), chemical vapor deposition (CVD), and electrochemical deposition (ECD) of copper metal. Rudolph's proprietary laser spectroscopic ellipsometry technology is used in the i-SL to address real-time integrated metrology of transparent films in processes. Rudolph said the i-SL tool can be integrated with processing systems used for advanced gate and gate-stack deposition, low-k dielectric film deposition, and CMP. The Flanders, N.J., company predicted that integrated metrology will be crucial in controlling and characterizing ultra-thin gate dielectrics and advanced high-k gate materials necessary for next-generation process technologies. "These new integrated metrology systems monitor key indicators of process integrity and detect processing shifts in real time, allowing immediate intervention to prevent losses," stated Paul McLaughlin, chairman and chief executive officer of Rudolph Technologies. Software for both integrated tools can automatically flag out-of-spec wafers using real-time, multi-point measurements, said the company. First shipments of the i-MP and i-SL systems are planned for early 2001. semibiznews.com