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To: Tenchusatsu who wrote (102873)4/24/2000 7:17:00 PM
From: Tony Viola  Read Replies (1) | Respond to of 186894
 
Ten, >. But if it does eat into capacity, I would expect Intel to favor Itanium over other products like Coppermine, Cascades, maybe even Willamette.

Interesting. Of course, we won't forget which side the bread is buttered on, right? Seems like Barrett has more to worry about nowadays than Andy ever did.

Tony



To: Tenchusatsu who wrote (102873)4/24/2000 9:48:00 PM
From: kash johal  Respond to of 186894
 
Tench,

AMD is getting close to blowing Intel away.

Thunderbird, Copper, DDR.

High Performance, High Mhz, leading edge value.AMD DEMONSTRATES FIRST AMD ATHLON? PROCESSOR PLATFORM SUPPORTING DOUBLE DATA RATE (DDR) MEMORY
--Demonstration featuring DDR Memory Modules from Leading Memory Manufacturers at WinHEC--
--Third Party Validation of DDR Memory and Chipsets Under Way--

NEW ORLEANS, LA--April 24, 2000--AMD today demonstrated a prototype AMD Athlon? processor platform featuring support for high performance double data rate (DDR) memory. DDR memory is the highest-bandwidth and lowest latency PC memory technology currently available, and is planned to enable the AMD Athlon processor platform to deliver new levels of performance on math-intensive applications like video editing, CAD/CAM, scientific applications, and Internet content creation.

The technology demonstration was done in conjunction with the leading memory manufacturers that plan to produce DDR memory this year, including Micron, Samsung, Toshiba, Hitachi, NEC, Hyundai, and Infineon Technologies. Both the AMD-760? chipset and DDR memory modules are planned to be available in the second half of 2000. DDR memory heavily leverages existing Synchronous Dynamic Random Access Memory (SDRAM) technologies, the most common memory found in today's leading PCs. Next-generation DDR memory is thus expected to be manufactured at cost levels that are in line with today's mainstream PC memory costs.

"Our OEM partners have requested that AMD develop next-generation chipsets that deliver high-performance platforms at competitive costs," said David Somo, vice president of product marketing for the Computations Product Group at AMD. "Responding to demand for DDR technology, AMD is working with the leading DDR memory manufacturers to help AMD deliver the next generation of high-performance AMD Athlon workstation and PC platforms."

"DDR memory technology has already made its way into high-end server platforms, driven by the performance, capacity, cost, and infrastructure continuity of the next-generation technology," said Bert McComas, principal analyst at InQuest Market Research. "The AMD-760 chipset looks to bring the advantages of DDR memory technology to the workstation and high-end PC user, where a key element in the memory performance equation is to deliver superior performance without adding significantly to system cost. DDR technology should to be the solution to deliver this combination."

Industry Support for DDR Memory Standard Continues To Grow
"Micron Technology is pleased to be demonstrating an AMD Athlon processor-based DDR SDRAM system in our booth at WinHEC," said Jeff Mailloux, director of DRAM Marketing for Micron. "Recent industry benchmarks establish that DDR SDRAM systems deliver industry-leading performance. Plus, we believe that we will be able to produce DDR SDRAM memory at similar costs as PC100/133 SDRAM. DDR SDRAM is an evolutionary step beyond SDRAM, enabling us to leverage current manufacturing processes. By combining leading-edge performance and competitive costs, the DDR SDRAM delivers multiple advantages to our customers."

"Samsung is dedicating millions of dollars to the design, manufacturing, and validation of high-performance, next-generation DDR memory modules," said Bob Eminian, vice president of marketing and corporate communications at Samsung Semiconductor, Inc. "The performance advantage DDR memory delivers, coupled with our ability to leverage current SDRAM manufacturing processes to bring DDR memory to market at competitive costs, will help accelerate the adoption and proliferation of this exciting new technology."

"Hyundai Electronics strongly supports Double Data Rate memory technology and has invested considerable resources into the design, manufacturing, and validation of high-performance, next-generation DDR memory modules," said Mario Martinez, director of strategic marketing at Hyundai Electronics America. "DDR memory delivers performance advantages that when coupled with Hyundai's proven SDRAM manufacturing process and significant capacity, makes adoption of DDR very attractive--both in terms of time-to-market and low-cost."

DDR Memory and Chipset Validation Work Underway
Additionally, today SMART Modular Technologies, Inc. announced the launch of an industry-wide DDR enabling Validation Program. As a member of JEDEC and AMI2, SMART is committed to helping enable new high-performance memory technologies. SMART is an independent, third-party validation test house which verifies critical DDR SDRAM specifications, providing OEMs with increased confidence when designing systems featuring DDR memory technology. The goal of this program is to verify that each supplier's DDR memory modules are functioning correctly with AMD's chipsets that support DDR memory. AMD has also been working closely with several memory vendors throughout the development phases of DDR devices and modules to ensure compatibility.

High-Performance DDR Memory
Double Data Rate (DDR) memory technology is the industry's successor to SDRAM. With DDR's 266 MHz bandwidth, it can achieve memory bandwidth up to 2.6 times the bandwidth of SDRAM, at similar costs.

AMD and its partners will be displaying AMD Athlon processor-based platforms supporting DDR memory for all WinHEC attendees at the AMD booth (#400). The conference is located in New Orleans, Louisiana from April 24 to April 26, 2000.

Cautionary Statement
This presentation contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are generally preceded by words such as "expects", "plans", "believes", "anticipates", or "intends." Investors are cautioned that all forward-looking statements in this presentation involve risks and uncertainty that could cause actual results to differ materially from current expectations. Forward-looking statements in this presentation about AMD chipset products involve the risk that AMD may not develop the new products on the expected timetable or at all, that third parties may not provide DDR memory as needed for support of the AMD chipsets, and/or that various DDR memory modules may not function correctly with AMD's chipsets. We urge investors to review in detail the risks and uncertainties in the company's Securities and Exchange Commission filings, including the most recently filed Form-10K.



To: Tenchusatsu who wrote (102873)4/24/2000 9:51:00 PM
From: kash johal  Read Replies (1) | Respond to of 186894
 
Tench,

AMD and MOT showing off softDSL on AThlon.

Yet another reason to dropkick the ole celerons, k6's and Piii's into never never land.Related Quotes

MOT
105
-6

delayed 20 mins - disclaimer


Monday April 24, 8:08 am Eastern Time
Company Press Release
SOURCE: Motorola SPS
Motorola Demonstrates SoftDSL(TM) Technology for Next-Generation PCs
Demonstration Signifies Emergence of SoftDSL Technology For Communications-intensive Applications Such as High-speed Video, Alternative PCs and Set-top Boxes
NEW ORLEANS, Motorola Booth Number: 100-102, April 24 /PRNewswire/ -- Motorola (NYSE: MOT - news) today announced the first public demonstration of Motorola's SoftDSL(TM) communications technology running on an AMD Athlon(TM) processor. Leveraging the latest PC processor advances, Motorola's SoftDSL technology gives PC OEMs a glimpse into next-generation low-cost broadband communications.

The demonstration is taking place this week at WinHEC in New Orleans where attendees will be able to view Internet surfing and full-screen streaming video demos that show SoftDSL modem performance capabilities and power. See the demonstration at Motorola's booth 100-102 and AMD's booth 400.

Motorola's SoftDSL technology represents the next phase in software communications. Using the power of the computer instead of a dedicated modem chipset, software communications eliminates the need for costly fixed-function hardware and enables PC OEMs to deliver next-generation PCs without compromising performance or functionality. According to VisionQuest 2000, software modems captured one-third of the PC modem market in 1999 with roughly 20 million unit shipments. VisionQuest also expects software modems to exceed 50 percent of the PC modem market in 2000, making them the dominant technology for PC communications. As PCs continue to offer more power at lower cost, PC OEMs can look to SoftDSL technology as a viable communications solution to meet consumer demand for the latest high-speed technology while keeping margins up. Motorola's SoftDSL technology offers dynamic upgradeability and reconfigurability to bridge multiple DSL standards and provides users with a smooth migration path from V.90 analog modem to broadband Internet access.

``Advances in processor technology from companies such as AMD enable SoftDSL solutions to emerge rapidly as a cost-effective, high-speed broadband communications solution,'' said Mike Tramontano, marketing director of Motorola's Software Products Division. ``PC OEMs can incorporate the latest communications technology into more of their PCs encouraging faster deployment of DSL services. Integrating low-cost SoftDSL modems into PCs eliminates the need for service providers to distribute and support end user equipment at the customer premise. At the same time, it gives end users a flexible product, easily adaptable to new features, functions and standards with simple Internet software upgrades.''

``AMD has designed our latest processors and platforms to deliver the features, performance, and headroom required to implement next-generation technologies such as Motorola's SoftDSL solution,'' said Mike Johnson, vice president, Advanced Architecture Lab at AMD. ``As one of the leading software communications technologies, Motorola's SoftDSL technology can work in conjunction with AMD Athlon processors to bring cutting-edge communications to the market, increasing the speed at which users access the Internet and enhancing the overall experience.''

About Motorola

Motorola's Software Products Division (SPD) is a leading supplier of software-based modems for today's cutting-edge personal computers. Combining software and processing power, Motorola delivers low-cost modem connectivity for desktop and notebook PCs that address issues of cost, quality and upgradeability for PC manufacturers and users.

As the world's #1 producer of embedded processors, Motorola Semiconductor Products Sector offers multiple DigitalDNA(TM) solutions to enable customers in the consumer, networking and computing, transportation and wireless- communications markets to create new business opportunities. Motorola's worldwide semiconductor sales were $7.4 billion (USD) in 1999. motorola.com

Motorola Inc. (NYSE: MOT - news) is a global leader in providing integrated communications solutions and embedded electronic solutions. Sales in 1999 were $33.1 billion (USD). motorola.com

Motorola is a registered trademark, and Digital DNA and Soft DSL are trademarks of Motorola, Inc.

For more information contact Stan Vernon of Motorola Software Products Division, 508-261-4428, stan.vernon@motorola.com.

SOURCE: Motorola SPS



To: Tenchusatsu who wrote (102873)4/24/2000 9:53:00 PM
From: kash johal  Respond to of 186894
 
Tench,

AMD and PCTEL demo ADSL gLite modems :Related Quotes

PCTI
30 5/16
-1 15/16

delayed 20 mins - disclaimer


Monday April 24, 10:00 am Eastern Time
Company Press Release
SOURCE: PCTEL, Inc.
PCTEL Pairs G.lite Soft Modem With AMD Athlon(TM) Processor
First Product Demonstration at Today's WinHEC Conference
MILPITAS, Calif., April 24 /PRNewswire/ -- PCTEL, Inc. (Nasdaq: PCTI - news), a leading provider of personal connectivity and Internet access technology, today unveils its LiteSpeed(TM) G.lite modem solution running on a platform powered by an AMD Athlon processor at the New Orleans Windows Hardware Engineering Conference (WinHEC) April 25-27.

LiteSpeed is a single-chip V.90/G.lite (analog/digital) combination modem based on PCTEL's patented Host Signal Processing (HSP) technology. By leveraging the processing power of the host CPU, the LiteSpeed modem gives manufacturers all of the flexibility of a software-based product at an economical cost, eliminating the need for a more expensive DSP-based solution. The PCTEL LiteSpeed chip is capable of connecting computers to the Internet at up to 1.5 megabits per second, more than 25 times faster than today's analog modems, and provides full feature support for DSL connectivity.

``Our LiteSpeed products are the industry's first ADSL/V.90 combo software-based modem solutions to meet the G.lite international standards,'' said Peter Chen, PCTEL's chief executive officer. ``They support the latest ADSL protocols, ensuring interoperability while providing manufacturers with the most compact, power saving and cost-effective solutions for internal combination V.90/G.lite modems. We're delighted to have the opportunity to show LiteSpeed's capabilities in conjunction with an AMD processor-powered PC.''

``Combining any of AMD's newest generation of processors with PCTEL's LiteSpeed modem will provide consumers with fast, easy Internet connections,'' said Mike Johnson, vice president of AMD's Advanced Architecture Lab. ``As DSL becomes more widely available, owners of PCs featuring AMD processors and LiteSpeed modems will be able to upgrade to next generation communications technologies while still delivering plenty of processing power.''

Both companies are also continuing their work on defining the Advanced Communications Riser (ACR) platform. The ACR supports specifications for communication cards that combine modem, audio, Local Area Network (LAN) and Digital Subscriber Line (DSL) technologies for products such as V.90 modems, Home PNA, Ethernet LANs and broadband DSL modems. The adoption of ACR specifications enables open standards design for riser-based broadband communications, networking, peripheral and audio subsystems. Design guidelines are also outlined for wireless and DSL bus operation systems.

``PCTEL and AMD continue to work with the ACR SIG to continue defining the new ACR riser platform specifications,'' Chen said. ``Since we are committed to the continued development of a highly-integrated broadband communications solution for the personal computing market, we believe that supporting the adoption of the ACR specification will speed the movement toward our goal.''

``By working to organize the industry behind a single, open standard, the ACR SIG is delivering a low-cost, high-performance communications architecture that can meet future PC communications requirements,'' said AMD's Johnson. ``AMD is excited to help drive the development and widespread deployment of this next generation specification.''

WinHEC is an annual conference sponsored by Microsoft and other manufacturers to give designers, engineers, developers and architects advance previews of Windows© technology developments. Attendees can see demonstrations of PCTEL's LiteSpeed modem running on an AMD Athlon processor in PCTEL's booth #222 and #224.

About PCTEL

PCTEL is a leading developer and supplier of cost-effective software-based connectivity solutions that enable high speed Internet access and other communications applications through emerging broadband and existing analog networks. PCTEL products are available worldwide through PC and data communications equipment manufacturers, as well as a variety of vertical market OEMs. PCTEL is located at 1331 California Circle, Milpitas, California, 95035. Telephone: 408-965-2100. Fax: 408-895-0178. For more information on PCTEL products, visit the PCTEL website at pctel.com .

Safe Harbor Statement

Under the Private Securities Litigation Reform Act of 1995, the statements made contained in this release which are not related to historical facts may be deemed to contain forward-looking statements, including but not limited to statements regarding deployment of the company's products, demand for the company's products and the success of strategic relationships. Actual results may differ materially from those anticipated in any forward-looking statements as a result of certain risks and uncertainties, including, without limitation, the company's dependence on strategic third parties to market and resell its services, intense competition for the company's products, dependence on growth in demand for DSL-based services and other risks and uncertainties detailed in the company's Securities and Exchange Commission filings. The Company disclaims any obligation to update information contained in any forward-looking statement.

SOURCE: PCTEL, Inc.



To: Tenchusatsu who wrote (102873)4/24/2000 10:03:00 PM
From: kash johal  Respond to of 186894
 
Tench,

DRESDEN in PRODUCTION.

RAMP IS FINE YIELDS ARE GREAT.

LOCK UP THE VALUABLES and THE WOMEN....AMD is on WARPATH:

Dresden fab is putting AMD back on the manufacturing map
By Jack Robertson
Semiconductor Business News
(04/24/00, 03:27:01 PM EDT)

DRESDEN, Germany -- Final proof that Advanced Micro Devices Inc. needs to show that it finally has gotten its manufacturing act together is located here in Germany. And its leading-edge Fab 30 is ramping up quickly now with a 0.18-micron process that features both copper interconnects and a gradual move to lower-k dielectrics.

Fab 30 manager James Doran, interviewed in his office here, sees no show-stoppers as the fab moves steadily towards its full production capacity of 5,000 eight-inch wafers a week. "We did our homework and moved gradually step-by-step to bring up all the new technology processes. And it is paying off now," he declares.

Some analysts agree. Jonathan Joseph, who covers the semiconductor industry for Salomon Smith Barney, believes that AMD will bring up its Dresden fab right on schedule with no major problems. Its first product is the company's most advanced Athlon-core device, the Thunderbird microprocessor.

The German fab "will give AMD a tremendous technology benefit against Intel Corp.," says the San Francisco-based analyst. Indeed, AMD believed more than a year ago that Fab 30 was going to rival Intel's technology (see story in the December 1998 Online Magazine). "Already, AMD is ahead of Intel with actual shipments of 800-MHz to 1-GHz Athlons," he maintains. "Intel is having trouble making deliveries of its higher-speed processors. Dresden should help AMD keep this edge."

The German fab couldn't come on line at a better time for AMD. Microprocessor demand has jumped sharply this spring and both AMD and Intel are now hard-pressed to produce enough chips to meet growing customer orders. Dresden currently is making about 600 wafers a week.

Sunnyvale, Calif.-based AMD now believes that microprocessor demand will soar so high that it ultimately will require all of Fab 30's capacity for its own products. Just recently, AMD had been thinking seriously about sharing Fab 30 capacity with another chip maker. (Motorola had been mentioned as the most likely candidate.)

Now, however, the sharing idea is evaporating fast. "As our business gets hotter and hotter, it's beginning to suck up more capacity," according to fab manager Doran. "It already looks as if AMD itself will need all the capacity at Dresden," he says.

Fab 30 is starting out by making the advanced Thunderbird processor--a 1-GHz-plus Athlon with 256-kilobits of SRAM cache embedded on the chip. But the fab has ability to make any Athlon processor version, Doran says.

"For the first time, AMD will have the flexibility to shift the production mix among different processors at several fabs," he says, "to meet rapid changes in the market. Intel has used this flexibility for some time to its great advantage," he adds. "Now AMD can follow the same strategy."

Since Dresden is now AMD's leading-edge fab, it likely will be the first plant to produce the next-generation Sledgehammer microprocessor, AMD's first 64-bit MPU.

Already the Dresden fab is proving skeptics wrong. They had speculated that AMD would have trouble getting all of the next-generation production technologies off the ground at the same time. But even with copper, where several chip makers found early yields disappointing, the new AMD fab "is finding copper processing no big obstacle," according to Doran.

He attributes the smooth copper ramp-up to extensive preparatory development. "We worked hand-in-hand with Motorola, our copper technology partner," he notes. "Engineers of both companies shuttled back and forth from Austin to Dresden. We also did our copper qualification using a mature K-6 test vehicle, carrying the process all the way to final full prototype testing. Only then did we move to qualifying Athlon using copper," Doran says.

The AMD vice president says the biggest copper challenge "is in finding [copper] line defects and improving the process. It just takes a good analytical effort, the same as fixing defects in aluminum," he adds.

Another hurdle that AMD had to overcome was developing the ability to plate lines using copper seeds without causing voids. The Dresden fab uses a mix of copper tools from three major vendors: Applied Materials, Novellus, and Semitool. But Doran declines for competitive reasons to identify the specific tool that each vendor provided.

He predicts its early use of copper will give AMD's upcoming Thunderbird a higher-frequency advantage over Intel processors because they still use aluminum connections. "Copper scales up in frequency better than aluminum," Doran says, "because of its inherent lower resistance."

As linewidths shrink to 0.18-micron-and-lower design rules, aluminum becomes more difficult to etch for defect-free lines, the AMD fab manager claims. And gaining experience with copper on 0.18-micron generation chips also will give AMD a head start when microprocessors move to the 0.13-micron node, he believes.

As far as the new dielectrics are concerned, the Dresden fab is starting a gradual shift to lower-k dielectric materials. AMD isn't settling on one specific low-k material, Doran says, but instead will gradually add a different, slightly lower dielectric material each time it modifies a fab line.

"There's a whole range of low-k materials out there," he says. "And it's easier just to keep qualifying a new material with a slightly lower dielectric value in an incremental step-by-step progression." The fab is working with so many different lower-k materials that Doran didn't want to identify what they were.

Dresden also is coming on line using nothing but lithography scanners to make all critical and non-critical layers. The all-scanner lines provide better critical dimension and overlay control than a mix-and-match process with lithography steppers, Doran says. So far, based on initial manufacturing test results, "this is proving to be the case," he notes.

Like all AMD fabs, the Dresden facility uses tools from ASM Lithography. The present 248-nm wavelength scanners can be extended below 0.18-micron processing, Doran says, but he didn't want to speculate how low the krypton-fluoride tools could be used.

Other state-of-the-art gear being used by Fab 30 includes front-loading SMIF carrier pods and an almost-completely automated pod delivery system supplied by PRI Automation Inc. Although AMD has not talked about specific plans yet for building a 300-mm wafer fab, this kind of automated pod delivery layout will provide the experience that the company will need when it does move to the next-generation wafer.

The Dresden facility has enough space for a second fab, but AMD wants to get Fab 30 up to full capacity before it starts talking about another line here. But there already are plans to build a chip assembly and test research center at the Dresden site. AMD already has set up a chip-set design center here, which developed a xDSL high-speed modem chip and is now working on the Lightning Fast Transport I/O interface for the next-generation chip-set that will support its Sledgehammer processor.