To: niceguy767 who wrote (107974 ) 4/26/2000 3:04:00 PM From: Steve Hursey Respond to of 1574491
Does anyone over here have any insight into the impact of heat build-up as chip speeds increase? The link below includes some discussion of a company that has provided AMD with pure silicon 28 for testing purposes based on its ability to improve heat dissipation. The discussion is about halfway down. Here is the gist with the whole link posted below. From the release: Now let's move on to silicon-28. We are very pleased with our progress. Research to date has been quite promising. Effort to penetrate the high performance microprocessor market is proceeding as planned. We are continuing to meet requests for, and provide wafers to, chip manufacturers such as Applied Micro Devices and Cyprus Semiconductor, and government supported research projects. Heat management remains one of the industry's greatest hurdles. Even the temperature distribution within the chip itself is a major issue. We believe silicon-28 is an answer. The response from conference participants at Semicon Europa 2000, Europe's largest semiconductor conference, indicated that our efforts promoting the benefits of isotopically pure silicon-28 have been quite effective. We were sought out by a number of companies wanting to try silicon-28 in such varied applications as silicon-germanium devices, SOI wafers, low temperature sensors and filters, photovoltaic devices and solar cells, power semiconductors, fiber optic devices, and a ``lab on a chip''. Working with these companies is an excellent way to leverage our resources to identify commercial opportunities, any one of which could result in substantial orders. We are continuing to develop our supply chain to demonstrate to potential customers that we can provide both epitaxial and bulk silicon-28 wafers at the appropriate quality, quantity, and price in order to make silicon-28 the material of choice in applications where its superior heat conductance properties can be fully exploited. During the next twelve months we plan to grow our present capacity of 100,000 epitaxial wafers per year to over 500,000. We also plan to produce an initial quantity of 1,000 bulk wafers and to grow that capacity to over 100,000 per year over the next 24 months. biz.yahoo.com Steve