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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Joe NYC who wrote (108328)	4/28/2000 4:59:00 PM
From: Scot	Read Replies (1) \| Respond to of 1570833

One thing I am wondering about Socket A and Socket 370 FlipChip packaging, looking at the picture, it appears that the contact area for the heatsink is limited to the area of the chip itself. Wouldn't it be advisable to make the contact area larger? It does seem small. I'm not a thermal-dynamics engineer....so I can't say. I wonder if this has something to the cache? I.e., on the slot packaging, the cache is similarly separate. All I can say is that this puppy is going to fly. I'm glad they're sold out, because Duron is going to blow away the current Athlon. I can hardly wait for T-Bird! -Scot

To: Joe NYC who wrote (108328)	4/28/2000 5:53:00 PM
From: Mani1	Respond to of 1570833

Joe re <<Wouldn't it be advisable to make the contact area larger?>> All the heat generated will be from the die, so you can not increase the contact area per se. The thermal management of Duron is up to the OEM not AMD. But considering the form factor, it is best to use as small as a heat spreader as possible. Knowing the maximum allowable junction temp (should be around 90) and the heat dissipated, thermal solution can be designed accurately. Duron will not have a thermal solution problem. Mani