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To: Ram Seetharaman who wrote (2793)	5/4/2000 11:13:00 AM
From: Ram Seetharaman	Read Replies (1) \| Respond to of 2946

Thursday May 4, 9:57 am Eastern Time Company Press Release SVG Addresses Customer Performance and Productivity Needs with Next-Generation 200/300 mm Lithography Platform New Platform Offers Single Solution for 248 nm, 193 nm and 157 nm Lithography WILTON, Conn.--(BUSINESS WIRE)--May 4, 2000-- Silicon Valley Group (Nasdaq:SVGI - news) introduced today a new high throughput lithography platform for next-generation 200 mm and 300 mm semiconductor chip manufacturing. The new platform roll out is a major strategic move, which supports the company's goal of providing the broadest spectrum of high performance, high productivity lithography products to ASIC, DRAM and logic customers worldwide. The company made significant headway in achieving this goal, particularly in Asia and North America, with recent wins resulting in sales to Conexant, Cypress Semiconductor, Lucent Technologies, SEMATECH and the world's leading microprocessor manufacturer as well as Samsung and another leading Korean chipmaker. The new platform will support critical and non-critical lithography on 200 or 300 mm wafers at either 248, 193 or 157 nm wavelengths. It enables SVG to offer a competitive and complete package of lithography solutions for the global marketplace which addresses low cost of ownership for all applications including logic, ASIC and DRAM. ``Feasibility of the all-optical roadmap through 157-nm production requires the tightest CD control and highest productivity,'' explained John J. Shamaly, president of SVG Lithography Systems. ``The innovative platform provides our customers with a high productivity 200/300 mm bridge tool wafer processing capability for critical and non-critical lithography applications while delivering superior linewidth performance.'' ``Our number one goal is to continue to develop commercially viable, technology solutions that provide our global customers superior performance for evolving 300 mm production,'' noted Papken der Torrossian, chairman and CEO of SVG. ``Our new Micrascan high performance platform is the logical choice in meeting global industry needs for productivity and performance in an extendable lithography platform. It also offers our customers an extendable platform to satisfy their needs which spans the evolution of technology.'' Saving valuable fab floorspace, the new Micrascan platform offers the smallest 300 mm lithography footprint in the industry. It maintains the size of SVG's current 200 mm tools thereby removing any negative footprint impact should customers decide to opt for a 200 mm solution as a stepping stone to 300 mm production. The platform converts from 200 to 300 mm with a single shift conversion and combines the industry's highest throughput per square foot with Micrascan's leading linewidth control. Its design is capable of supporting a variety of optical trains, enabling cross-generational capabilities. About Silicon Valley Group Silicon Valley Group (Nasdaq:SVGI - news) is a leading manufacturer of automated wafer processing equipment for the worldwide semiconductor industry. The company designs, manufactures and markets technically sophisticated equipment used in the primary stages of semiconductor manufacturing. Its products include photolithography exposure tools; photoresist processing equipment; oxidation, diffusion and low-pressure chemical vapor deposition processing systems; atmospheric pressure chemical vapor deposition systems and precision optical components and systems. For more information, visit svg.com. Forward-looking Statement Disclaimer: The matters discussed in this news release, and in particular statements made by the Chairman of SVG and the President of SVG Lithography Systems, include forward-looking statements that involve risks and uncertainties including but not limited to difficulties encountered or the benefits derived from customers using the new cross performance Platform. For a complete review of the risks facing the Company, including economic conditions, industry conditions, trade environment and other risks, reference is made to the Company's filings with the Securities and Exchange Commission. Particular reference is made to the Company's most recent Forms 10-K and 10-Q, which detail such risk factors. Contact: Silicon Valley Group Inc. Werner Rust, 408/467-5949 rustw@svg.com Nancy Szymanski, 408/467-5870 (Investor Relations) szymansn@svg.com or Mathews & Clark Stewart Chalmers, 408/736-1120 schalmers@mathewsandclark.com