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To: John Finley who wrote (9)	5/4/2000 10:14:00 AM
From: kinkblot	Respond to of 83

I wondered about that, too. From the October 13, 1999 press release about the cooperative program with Gemplus: The two companies are cooperating on a program to use integrated circuit (IC) manufacturing technology on SOI substrates for smart card applications. I too assumed that by "Smart Cut® Applications" they meant as distinguished from the more standard SOI wafer applications, but maybe it's just a catch-all category? For smart cards, the only reason I can think of why they might use lift-off is that they need a very thin, flexible chip. Based on the press release, I think I'll assume Gemplus is not using lift-off. WT