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To: Demosthenes who wrote (2819)	6/14/2000 11:53:00 AM
From: Ram Seetharaman	Read Replies (1) \| Respond to of 2946

Wednesday June 14, 11:00 am Eastern Time Company Press Release SOURCE: Silicon Valley Group SEMICONDUCTOR300 Awards SVG for Tool Readiness SAN JOSE, Calif., June 14 /PRNewswire/ -- Silicon Valley Group (Nasdaq: SVGI - news) announced that SEMICONDUCTOR300, a joint venture between Infineon and Motorola based in Dresden, Germany, has recognized SVG Thermal Systems for 300 mm tool readiness in the furnace area. SVG has established track records in the 300 mm pilotline in Dresden and the award recognizes SVG for its technology leadership. ``We are fully committed to providing customers with 300 mm ready RVP (rapid vertical processor) tools,'' noted Jeff Kowalski, SVG Thermal Systems president. ``The combined team effort of SVG and SEMICONDUCTOR300 has paid off, allowing SEMICONDUCTOR300 to meet its objectives and SVG to develop a state-of-the-art RVP 300 mm furnace ready for volume production.'' Based on established metrics from the 300 mm equipment teams, tool readiness was determined based on a tool report card measuring key parameters such as Cpk, cost of ownership and computer integrated manufacturing/automation. SVG's advanced vertical processor (AVP) oxide demonstrated the ability to meet those criteria on time for tool production. About Semiconductor300 The mission of Semiconductor300 GmbH & Co. KG is to achieve a breakthrough in manufacturing effectiveness by attaining substantial cost reductions per chip, compared to 200 mm wafers, utilizing process technologies below 0.2 micron. Semiconductor300 has been partnering with semiconductor equipment manufacturers in order to provide fast feedback for development of cost-effective, next-generation tools that will benefit the entire semiconductor industry. Milestones have been the formation of the joint venture between Siemens and Motorola in January 1998, first functional silicon (64M DRAM) on a 300 mm wafer from the Dresden pilot line in February 1999, and a yield of the pilot line that exceeds 200 mm wafer potential (yield = 60%) in June 1999 and the shipments of 64M products to customers after full qualification of the product. Semiconductor300 represents a total R&D expenditure of more than DM 1 billion ($595 million). The project of Infineon, Motorola and 18 partner companies is supported by the German Federal Ministry of Education and Technology (BMBF) and the State of Saxony. Further information at sc300.de. About Silicon Valley Group Silicon Valley Group is a leading manufacturer of automated wafer processing equipment for the worldwide semiconductor industry. The company designs, manufactures and markets technically sophisticated equipment used in the primary stages of semiconductor manufacturing. Its products include photolithography exposure tools; photoresist processing equipment; oxidation, diffusion and low-pressure chemical vapor deposition processing systems; atmospheric pressure chemical vapor deposition systems and precision optical components and systems. For more information, visit svg.com. Forward-looking Statement Disclaimer: The matters discussed in this news release include forward-looking statements made by the Company's Thermal Systems president that involve risks and uncertainties including but not limited to economic conditions, industry conditions, trade environment and other risks discussed more fully in filings by the Company with the Securities and Exchange Commission. Reference is made to the Company's most recent Forms 10-K and 10-Q, which detail such risk factors. SOURCE: Silicon Valley Group