To: pompsander who wrote (43953 ) 6/10/2000 6:06:00 PM From: Bilow Respond to of 93625
Hi pompsander; Re the memory bandwidth situation of 2003. When 2003 arrives, solutions for the engineering problems of that time will also arrive. The whole theme of the DDR movement is no technology before its time. Let the engineers of 2002 handle the bandwidth problems of 2003. One of the problems with trying to predict too far into the future with technology (and tech stocks) is that the ground rules change so quickly. With Rambus, the ground rule that changed was the cost of pins. Back when Rambus started, chips were connected to pins by something called "bonding wires", which were tiny wires individually welded at one end to the silicon chip, and at the other end to the package. These were visible inside the olde EPROMs, for instance. Back then, every pin was expensive. Nowadays, BGA and flip-chip technologies have eliminated bonding wires, and pins are darn near free. The pin expense is now more in the cost of the board they connect into, rather than the cost of the package. (Too many pins causes an increase in the number of board layers.) That is why the new 288Mb RDRAM chips are being put into packages with 92 pins instead of the 76-pin packages that the previous generation RDRAM went into. Simply put, package pins are (almost) free. Who knows what technology will show up in the next 4 years. The next big hurdle in reducing the cost of connecting chips together into systems (which is essentially Rambus' mandate), is the cost of the board, not the package. My bet for the solution to the board cost problem is MCM, which is why every now and then I post a set of links to MCM articles. -- Carl