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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Joe NYC who wrote (115390)	6/11/2000 12:41:00 AM
From: pgerassi	Read Replies (1) \| Respond to of 1583880

Dear Joe: An 8" wafer is 203mm in size or about 32,400mm2. Duron is about 106mm2 @ .18u. At .15u, that is about 74mm2. 0.15u is what AMD claimed the 0.18u equipment is really good to. The dresden equipment is supposedly good to 0.10u or 0.09u. 32.4kmm2 / 74mm2 is 437 die per wafer. Allowing for edges, cuts, and wastage of 10% overall gives 394 possible die per wafer. 300 known good die would indicate a yield of about 76%. This is doable after running a process for a year. At a Tbird at 120mm2 on .18u to same size Mtang on .15u is 83mm2. A 512K Mtang would be 96mm2 and a 1M Mtang would be 122mm2. 32.4kmm2 / 96mm2 is 337 die times 90% is 303 die. 200 known good die would make a yield about 66%. This is less than Dresden gets now. To get to .18 multiply above by 0.7, to .17 multiply by 0.78, and to 0.16 multiply by 0.88. Pete