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Technology Stocks : Amkor Technology Inc (AMKR) -- Ignore unavailable to you. Want to Upgrade?

To: tech101 who wrote (713)	6/13/2000 5:27:00 PM
From: tech101	Read Replies (1) \| Respond to of 1056

System in Package Prototype Line Opens at Amkor's Arizona Facility CHANDLER, Ariz. - June 13, 2000 - Intense customer interest in System in Package (SiP) technology has led Amkor Technology, Inc. (Nasdaq: AMKR) to open an advanced SiP module prototyping line at its Chandler, Ariz., facility. SiP is emerging as a useful complement to System on a Chip (SoC) designs. SiP modules consist of multiple semiconductor chips, plus passive circuit elements in a modified conventional IC package. SiP packages are important elements in cell phones and other wireless/RF applications. They also are critical to memory modules and high speed switches. SiPs will see extended future use in vision and opto-electronic applications. Unlike SoC chips, SiP modules allow designers to mix semiconductor technologies. For example, modules could combine separate silicon CMOS memory and logic chips, or different kinds of memory. Alternatively, they could combine CMOS chips for baseband digital processing alongside bipolar silicon or GaAs chips for data conversion or radio functions. For companies with limited resources, SiP modules allow designers to combine smaller, easier-to-design chips, rather than place all functionality into a "bet-the-company" single-chip design. SiPs also save silicon real estate by moving passive components off the die and onto or into the package substrate. Finally, because interconnect-length is much shorter, SiP modules can support higher processing speeds than designs based on individually packaged components. The challenge of designing systems based on SiP modules is the requirement for close coordination between chip design, package design, and test development. The prototyping facility enables that coordination and ensures the most efficient transition between design, production and test. Amkor built the prototype line at its Chandler facility to provide ready access for customer design centers. Actual production-volume SiP assembly takes place at Amkor's Bi¤an, Philippines, P4 factory. Patrick McKinney, Amkor senior vice president of business development and marketing for Amkor's Modules Group said, "SiP has reached the stage where a number of Amkor's customers have ongoing products in development. In addition to the physical facility, we are actively staffing-up with experienced designers, particularly in the radio-frequency discipline. We also support turnkey supply chain management for SiP module assembly." The prototyping facility can handle both flip chip and wirebond assembly processes. It includes: a Speedline MPM 2000 screen printer, a Philips topaz X chip-placement system, a BTU reflow oven for attaching passives, a GPD in-line aqueous cleaner, a Datacon APM die-attach machine, K&S wire bonders, a FICO transfer mold system, a K&S 7500 saw-singulation system, and a Lumonics laser-mark system. For flip chip assembly, the SiP prototype lab is adjacent to Amkor's Datacon flip chip pilot line.