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To: tech101 who wrote (716)	6/16/2000 12:03:00 PM
From: Artslaw	Respond to of 1056

ChipPAC, yet another packaging company that counts Intel among its customers (who doesn't Intel use now that they've bought so many companies!?), is filing an IPO. biz.yahoo.com Among the packaging and test services ChipPAC focuses on are ball grid array packages which are considered the most advanced mass produced type of package, according to the filing. The company also sells advanced packaging products for semiconductors used in wireless and wireline communications applications. Sound familiar? Steve