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Technology Stocks : SILICON STORAGE SSTI Flash Mem -- Ignore unavailable to you. Want to Upgrade?

To: Allegoria who wrote (628)	7/6/2000 4:24:41 AM
From: Don Edgerton	Read Replies (3) \| Respond to of 1881

Please note the following. This implies a 60 fold increase in use of memory in cell phones in the next 3 years. Note sure if this is a SSTI niche - but regardless don't think capacity is expanding this fast. " Wednesday July 5, 4:57 pm Eastern Time Company Press Release AMKOR EXPANDS STACKED CHIP-SCALE PACKAGE CAPACITY AND 3D PACKAGING FAMILY Reduces cellphone size and weight, increases memory capacity allows faster time to market CHANDLER, Ariz.--(BUSINESS WIRE)--July 5, 2000--Amkor Technology (Nasdaq: AMKR - news) has expanded its stacked chip scale package (S-CSP) production capacity to 400,000 units per week as the next step in its comprehensive plan to lead the industry in these advanced technology packages. The company also is increasing its research and development budget for 3D packaging in preparation for the increased broad market demand in cellphones and new portable applications being forecast by leading analysts. A recent study by Prismark Partners, a Cold Spring Harbor, NY market research/technology consulting firm, forecasts S-CSP Flash memory utilization in cellphones to grow from two percent in 1999 to 45 percent in 2003. This increased rate of utilization, coupled with continued growth of cellphone production from 258 million units in 1999 to a forecasted 696 million units in 2003, creates a significant demand for S-CSP packages. Amkor developed its S-CSP packaging technology, which combines two or more integrated circuits (ICs) in a stacked die configuration, to help original equipment manufacturers (OEMs) meet consumer demand for devices with more functions, that are thinner, more capable and reliable, and that are lighter weight. These new portable electronic devices include advanced cellular telephones (including the new third generation systems), personal digital assistants (PDAs), handheld personal computers, camcorders and other portable consumer products. Amkor has delivered more than three million stacked chip scale packages to cellphone manufacturers in Japan and Europe since starting production last November. The major mobile phone suppliers were the first to recognize the benefits stacked CSPs deliver, and are planning wider adoption in new model cellphones, according to industry studies. The company expects S-CSP deliveries to grow in the second half of 2000 as new customers begin receiving shipments. ``Semiconductor stacking technology offers higher levels of silicon integration without the cost or time-to-market trade-offs associated with system on a chip or embedded memory approaches,'' said Vince DiCaprio, vice president of advanced application development for Amkor Technology. ``Our stacked CSP platform and 3D packaging family provide designers with the flexibility to stack different devices inside industry standard chip scale packages, delivering improved performance and greater cost effectiveness. We accomplish this without sacrificing low mounted height.'' Stacked CSP packages can include a range of device combinations, including Flash/ SRAM, logic/memory, digital signal processors (DSP)/memory, logic/RF and others. Stacking two or more standard devices in a single package can be more cost effective than system on a chip or an embedded memory device. It also makes final installation of the package into its end product faster and less costly for the OEM. To increase the reliability of the package while keeping it as thin as possible, Amkor uses a film adhesive between the top and bottom die. This process reduces the stress that typically occurs between the top and bottom die in the package. The S-CSP uses proven thin-core substrate material, thin ICs and a conventional ball grid array (BGA) configuration that matches existing surface mount technology and industry test and handling infrastructure. Additionally, a stacked chip configuration permits more circuits and interconnection to exist within the package, which not only reduces the required component mounting area and input/output (I/O) on the motherboard, but also improves electrical performance and reliability. Amkor's technology platform also permits a larger variety of ICs and die sizes to be used in the package. Stacked CSP packages have a maximum thickness of 1.4 mm, with 0.5 to 0.8 mm pitch on the I/O solder balls. An 8 mm x 10 mm x 1.4 mm Flash/SRAM package can contain up to 100 I/Os. Logic/Flash, digital/analog and DSP/Flash combination packages can be up to 18 mm on a side and contain over 200 I/Os. This 3D packaging technology also has significant potential for use in Amkor's system in package (SiP) products. About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. Forward-Looking Statement: This news release may contain forward-looking statements that involve risk and uncertainty that could cause actual results to differ from anticipated results. Further information on risk factors that could affect the outcome of events set fourth in these statements and that would affect the company's operating results and financial condition is detailed in the company's filing with the Securities and Exchange Commission, including the Report on Form 10-K for the fiscal year ended December 31, 1999. 2000-20-07-05-00-Amkor Expands Stacked Chi-Scale Package Capacity and 3D Packaging Family "