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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Mephisto who wrote (35792)	7/17/2000 4:19:12 PM
From: Proud_Infidel	Respond to of 70976

NEC in discussions for second wafer fab in China By Jack Robertson Electronic Buyers' News (07/17/00, 03:35:40 PM EDT) WASHINGTON -- NEC Corp. in Tokyo is in discussions with its Chinese chip partner, Shugong Steel, about a second joint-venture fab in Beijing, according to NEC chairman Hajime Sasaki. Sasaki said NEC will transfer 0.25-micron processing technology for a new 8-inch wafer fab to be financed by Shugong. NEC already has an 8-inch wafer joint- venture fab, called NEC Hua Hong Semiconductor Co., in Shanghai.

To: Mephisto who wrote (35792)	7/17/2000 4:22:30 PM
From: Proud_Infidel	Read Replies (2) \| Respond to of 70976

NEC in discussions for second wafer fab in China By Jack Robertson Electronic Buyers' News (07/17/00, 03:35:40 PM EDT) WASHINGTON -- NEC Corp. in Tokyo is in discussions with its Chinese chip partner, Shugong Steel, about a second joint-venture fab in Beijing, according to NEC chairman Hajime Sasaki. Sasaki said NEC will transfer 0.25-micron processing technology for a new 8-inch wafer fab to be financed by Shugong. NEC already has an 8-inch wafer joint- venture fab, called NEC Hua Hong Semiconductor Co., in Shanghai.

To: Mephisto who wrote (35792)	7/18/2000 9:07:35 AM
From: Proud_Infidel	Read Replies (2) \| Respond to of 70976

Ultratech Stepper and Applied Materials Sign Technology Licensing Agreement SAN JOSE, Calif.--(BUSINESS WIRE)--July 18, 2000--Ultratech Stepper, Inc. (Nasdaq NM: UTEK - news) today announced that Applied Materials, Inc. (Nasdaq NM: AMAT - news) and Ultratech have entered into an agreement under which Applied Materials will license the laser thermal processing (LTP) technology of Ultratech's Verdant Technologies Division. Verdant's process, which involves projection optics and short pulse laser technology, is expected to be used for forming advanced contacts and junctions at 0.10 micron and below geometries. Certain of the statements contained herein may be considered forward-looking statements that involve risks and uncertainties, such as the dependence on new product introductions and commercial success of any new products, integration and application of the licensed Verdant technology, manufacturing inefficiencies and absorption levels, risks associated with introducing new technologies, cyclicality in the semiconductor and thin film head industries, delays, deferrals and cancellations of orders by customers, pricing pressures, competition, lengthy sales cycles for the company's systems, ability to volume produce systems and meet customer requirements, the mix of products sold, the failure to develop and commercialize the ISI products, inventory obsolescence, economic and political conditions in Asia, delays in collecting accounts receivable, extended payment terms and changes in technologies. Such risks and uncertainties are described in the company's SEC reports including the company's Annual Report on Form 10-K for the period ended December 31, 1999 and Form 10Q filed on March 31, 2000. About Ultratech: Founded in 1979, Ultratech Stepper, Inc. designs, manufactures and markets photolithography equipment used worldwide in the fabrication of semiconductors, thin film heads (TFH) for disk drives, and micromachined devices. The company produces products that substantially reduce the cost of ownership for manufacturers in the electronics industry. The company's home page on the World Wide Web is located at www.ultratech.com.