To: Philip W. Dunton, Jr who wrote (4199 ) 7/26/2000 9:19:29 AM From: Proud_Infidel Read Replies (1) | Respond to of 5867 Semiconductor Mfg. Equipment for 300mm to Reach 30-40 Pct. of Sales by 2004, Tokyo Electron Exec. Says July 26, 2000 (TOKYO) -- Tetsuo Tsuneishi, executive vice president of Tokyo Electron Ltd., said manufacturing equipment for 300mm wafers will reach 30-40 percent of his company's sales in the future. Tokyo Electron will develop its semiconductor manufacturing equipment for 300mm wafers based on a 0.13-micron design rule. Mass production is planned within this year. Sales of such manufacturing equipment of the company will account for 30 percent to 40 percent of total sales in 2004, Tsuneishi said. According to Tsuneishi, among the mass production equipment the company is ready to sell are application/development units, etching system units, oxidization/diffusion furnaces and wafer probers. It will proceed with the development of a wafer deposition unit (wafer-CVD) and a cleaning system unit and finish preparations within this year, he said. With such moves by the equipment maker, he forecasts that leading LSI chip makers will start constructing production lines for mass producing the 300mm wafer in 2001, and then start them on a full scale between the latter half of 2001 and the beginning of 2002. However, some LSI chip makers are delaying their shift to production of 300mm wafers intentionally because they are producing various types of LSI chips or they don't need to produce 300mm wafers. And some intend to avoid risks accompanying the 300mm production. As a result, migration to 300mm wafers will proceed step-by-step, and will take about five years to complete, Tsuneishi said. Tokyo Electron's sales of manufacturing equipment for 300mm wafers are expected to account for 5-6 percent of its overall sales in 2000, 10-20 percent in 2001, 20-30 percent in 2002, and 30-40 percent in 2004, according to Tsuneishi. (Nikkei Microdevices)